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TechDay: Disruptive Medical Wearables - Executive Networking Event
Wednesday 28 November 2018, 01:30pm - 07:30pm
Contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)
link disruptive 2018 646x220
 

The Internet of Medical Things (IoMT) is powering industry momentum in digital health and reinventing healthcare organization. Connected medical devices are leveraging sensing and connectivity semiconductor technologies to address the main healthcare challenges: increase the quality of care, while reducing the overall cost.

The consumerization of healthcare is attracting ever more capital from investments funds and electronics companies, leading to intensive R&D in the medical wearables space. A new wave of wearable products is expected to flood the market in the next few years. Who will benefit from this market? Who are the players involved? How will the value be shared? What are the remaining challenges at both the manufacturing and application levels?

Yole Développement, CSEM and Iftest AG are joining forces to offer an executive-level event covering the entire medical wearables value chain, from component manufacturers to healthcare service providers. Register today to attend high level technical and market presentations. Enjoy extensive networking time!

 

This email address is being protected from spambots. You need JavaScript enabled to view it.

 

AGENDA
To be revealed soon !


ABSTRACTS
To be revealed soon !

 

We encourage you to attend the TechDay and make sure you will not miss any key information. 

For any question, please contact Fanny Vitrey, Marketing & Communication Assistant (This email address is being protected from spambots. You need JavaScript enabled to view it.). Seats are limited, be part of it!


                                                                        Organized by
  logo yole moyen     logo csem      logo iftest

 

Location Geneva, Switzerland

Past events



Category: Imaging

From: Friday September 7 To Friday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 6 To Thursday September 6, Location: Shenzhen, China



Category: MEMS & Sensors

From: Thursday September 6 To Thursday September 6, Location: Shenzhen, China



Category: Manufacturing

From: Wednesday September 5 To Wednesday September 5, Location: Shenzhen, China



Category: Advanced Packaging

From: Wednesday June 20 To Thursday June 21, Location: Wuxi, China



Category: Compound Semi

From: Monday June 11 To Tuesday June 12, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday June 6 To Wednesday June 6, Location: Nuremberg, Germany



Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China



Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China

September 2018
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