Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

YOLE EVENTS

Previous month Previous day Next day Next month
By Year By Month By Week Today Search Jump to month
Market Briefing: Enabling Advanced Packaging Technologies for the Connected World
Tuesday 27 October 2015, 05:15pm - 07:30pm
Contact Clotilde Fabre - This email address is being protected from spambots. You need JavaScript enabled to view it.

Market Briefing Advanced Packaging Technologies Connected World iMaps Yole hbanner

MARKET BRIEFING -
SPEAKERS -
YOLE on IMAPS -
PRESENTATIONS

 

IMAPS and Yole Développement announce the “Enabling Advanced Packaging Technologies for the Connected World” Technology and Market Briefing. The edition will take place on October 27th, 2015 during iMAPS Orlando Symposium, from 5:15 to 7:30 PM. 

Both partners, strongly involved in this area, propose a dedicated session focused on the latest developments in Advanced Packaging. Industry leaders, experts in this market, will join Yole Développement analysts in addressing current needs and challenges that will have to be addressed in order to enable connectivity, the latest technology advancements and market trends.

This briefing will provide a great mix of technology and business perspective, market analysis combined with networking sessions.
Please join Yole Développement & IMAPS event and their guests, for an exciting session with interactive presentations on the latest innovations and industry trends.

Agenda: 

5:15 PM - Welcome

5:20 PM - What is the status of the Advanced Packaging  and how is Connectivity impacting this market?
Rozalia Beica, CTO and Business Unit Director, Yole Développement - More

5:40 PM - FOWLP Technology eWLB-Enabler for Packaging of IoT/IoE Modules
Dr. Steffen Kroehnert, Director of Technology, Nanium - More

6:00 PM - TBA
Rich Rice, Sr. VP Business Development, ASE GROUP - More

6:20 PM - Advanced Packaging and System Security
Farhang Yazdani, President & CEO, BroadPak Corporation - More

6:40 PM - Emerging Packaging Platforms for System Integration
Dr. Li Li, Distinguished Engineer, Cisco Systems - More

7:00 PM - Panel Session and Networking time

 

For any questions, please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.)

 

 

Organised by Hosted by With the participation of
Yole Développement iMaps nanium ase broadpak UTF 8frAL W Cisco

 

 

 

 

Location Orlando, USA

Past events



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China



Category: MEMS & Sensors

From: Wednesday November 4 To Friday November 6, Location: Paris, France



Category: Advanced Packaging

From: Tuesday October 27 To Tuesday October 27, Location: Orlando, USA



Category: Compound Semi

From: Monday August 31 To Tuesday September 1, Location: Shenzhen, China

March 2017
S M T W T F S
1 2 3 4
5 6 7 8 9 10 11
12 13 14 15 16 17 18
19 20 21 22 23 24 25
26 27 28 29 30 31