|MARKET BRIEFING -
|| YOLE on IMAPS -
IMAPS and Yole Développement announce the “Enabling Advanced Packaging Technologies for the Connected World” Technology and Market Briefing. The edition will take place on October 27th, 2015 during iMAPS Orlando Symposium, from 5:15 to 7:30 PM.
Both partners, strongly involved in this area, propose a dedicated session focused on the latest developments in Advanced Packaging. Industry leaders, experts in this market, will join Yole Développement analysts in addressing current needs and challenges that will have to be addressed in order to enable connectivity, the latest technology advancements and market trends.
This briefing will provide a great mix of technology and business perspective, market analysis combined with networking sessions.
Please join Yole Développement & IMAPS event and their guests, for an exciting session with interactive presentations on the latest innovations and industry trends.
5:15 PM - Welcome
5:20 PM - What is the status of the Advanced Packaging and how is Connectivity impacting this market?
Rozalia Beica, CTO and Business Unit Director, Yole Développement - More
5:40 PM - FOWLP Technology eWLB-Enabler for Packaging of IoT/IoE Modules
Dr. Steffen Kroehnert, Director of Technology, Nanium - More
6:00 PM - TBA
Rich Rice, Sr. VP Business Development, ASE GROUP - More
6:20 PM - Advanced Packaging and System Security
Farhang Yazdani, President & CEO, BroadPak Corporation - More
6:40 PM - Emerging Packaging Platforms for System Integration
Dr. Li Li, Distinguished Engineer, Cisco Systems - More
7:00 PM - Panel Session and Networking time
|Organised by||Hosted by||With the participation of|