Gathering more than 90 attendees, covering the whole supply chain of the photonics industry, this first edition was a real success.
In the hands of a professional moderator, the program of the forum included companies as Intel, Sicoya, Hewlett Packard Enterprise, Soitec, teem Photonics, System Plus Consulting, Yole Développement and Peking University; They presented their activities and vision. The audience was able to meet and discuss with main players of the silicon photonics industry.
It was the opportunity to better understand the promising market that is the silicon photonics industry. Driven by data center interconnects, more applications are looming for pics! The market will boom, with 400G growing faster than 100G for Si photonics. Beyond the tipping point, but not yet fully mature!
In only a few years, Intel has become the number two supplier for silicon photonics-based optical transceivers.
“Si photonics will have the highest CAGR of 44% in volume”, announced Eric Mounier, PhD, Fellow Analyst at Yole. “It will grow from around US$455 million in 2018, equating to 1.3 million units, to around US$4 billion in 2024, equating to 23.5 million units.”
“In only a few years, Intel has become the number two supplier for silicon photonics-based optical transceivers,” comments Sylvain Hallereau, Expert Analyst, at System Plus Consulting.“Intel has succeeded because it put a lot of effort into the bottleneck, which was integrating the laser chip through InP chiplet bonding followed by post processing.”
A special thanks to the speakers, moderator, attendees and our sponsors STAr Technoliges and CompoundTek, to make this first edition a success !
Find agenda, speaker details and other information about the Forum here.
Silicon Photonics and Photonic Integrated Circuits 2019
Market & Technology Report by Yole Développement
Silicon photonics: beyond the tipping point!
Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver
Structure, Process & Cost Report by System Plus Consulting
Deep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development, along with the main optoelectronic components in the connector.
Login to access to our Analysts' presentations on all expertise
Related Reports and Monitors
GaN-on-Si HEMT vs Superjunction MOSFET Comparison 2019
Reverse Costing - Structural, Process & Cost Report
Power GaN 2019: Epitaxy, Devices, Applications & Technology Trends
Market & Technology