Fan-Out packaging: what will be the next killer applications?

“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies and Market Trends report, 2020 edition announces 15,9% CAGR between 2019 and 2025 to become a US$3 billion market at the end of the period”.

Fan-Out packaging is increasingly being adopted in 5G, HPC and RADAR 77-GHZ announces Yole in its 2020 Fan-Out report. Fan-Out packaging is going to experience one of the sharpest growths for AiP[1] applications (5G-driven) at a whopping 76% CAGR between 2020 and 2025. Separately, (x)PU die partitioning and (x)PU + HBM[2] applications are growing strongly at 20% CAGR and 52% CAGR respectively, over the same period. Both applications are showing a need for higher computing performance. Connectivity related applications, including Bluetooth, plus MEMS[3], PA[4] and switches, are expected to power forward with a 14% CAGR.

Which companies will strongly change the Fan-Out market landscape? What are their market shares? What are the new Fan-Out packaging-based products? Yole’s analysts give you today an impressive and accurate update of this industry… Full story

Source: http://www.systemplus.fr, http://www.yole.fr

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