Market briefing and technology reveal of the latest processor products
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Moore’s law has been slowed down but it has not yet reached its limit, semiconductor processor manufactures have rolled out their latest products using the smallest technology node in the market. The groundbreaking processor chips integrate several functions that allow for exceptional performance. The processors are fully optimized for remote work capabilities and designed to cater for different consumer and industrial applications. Chip size and architecture play a vital role in the component function and manufacturing cost. Apple has penetrated the processor market with their first inhouse designed System on Chip product that has created shockwaves throughout the processor and computer world. It features a software-hardware integration inside the processor that enables a compact, efficient processor for personal computing that outcompetes many premium microprocessors.
While Apple’s corner of the broader PC market is relatively small, it is regarded at the high end of performance and user-experiences. Thus, the decision to pivot away from x86-based processors is a vote of confidence for the ARM-based architecture that has been a mainstay in mobile device. Other PC OEMs are taking note to understand whether and how they can replicate Apple’s success. Further market repercussions into datacenter computing would be harder to imagine, but players who would never consider a major architecture change due to high switching costs, now have an example from Apple on how it can be done.
John Lorenz is a Technology and Market Analyst within the Computing & Software division at Yole Développement (Yole). After holding various positions within Micron Technology including engineering, strategic and finance roles, John is daily engaged in the development of market and technology monitors for the logic segment of advanced semiconductors at Yole. John has a Bachelor of Science degree in Mechanical Engineering from the University of Illinois Urbana-Champaign (USA), with a focus on MEMS devices.
Belinda Dube serves as a Technology & Cost Analyst at System Plus Consulting, part of Yole Développement.
Belinda’s core expertise is memory technology, especially DRAM and 3D NAND flash memory. At the same time, she also investigates IC technologies as well as advanced packaging. Belinda’s mission is to develop reverse engineering & costing reports. She also works on custom projects, where she works closely with the laboratory team to set up significant physical & chemical analyses of innovative memory chips. Based on the results, Belinda identifies and analyzes the overall manufacturing process and all technical choices made by the memory makers.
Prior to System Plus Consulting, Belinda had the opportunity to work on several R&D projects dedicated to MEMS technologies and new substrates at INSA (Lyon, France).
With a core Micro & Nano Electronics expertise, Belinda graduated from INSA (Lyon, France) with a master’s degree in Instrumentation & Nanotechnology Engineering.
Related reports & monitors:
- Processor Quarterly Market Monitor
While finding new application, and sustaining the established ones, CPUs, GPUs, and APUs hold the keys to the next ten years of the processor market.
- Apple M1 System-on-Chip
A deep-dive analysis of Apple’s first in-house CPU for Mac.
Related Reports and Monitors
Apple M1 System-on-Chip
Reverse Costing - Structural, Process & Cost Report
Status of the Advanced Packaging Industry 2021
Market & Technology