The 71st IEEE Electronic Components and Technology Conference (ECTC) started on June 1 and remained open until July 16, 2021 due to popular demand. The conference was held virtually, and attracted 1,380 attendees from 23 countries. The 71st ECTC included 346 papers in 46 technical sessions and a record 14 special sessions and panels, delivering the latest in packaging R&D, and industry insights. The Heterogeneous Integration Roadmap workshop was integrated into the ECTC platform. Professional development courses on 14 topics were delivered by industry experts. The conference was a resounding success in connecting technologists globally during the pandemic, giving assurances of strong comeback post-pandemic.
The hottest topics in ECTC 2021 reflected the interests in 2.5 and 3D heterogeneous integration, chiplet enabled advanced packaging approaches and wafer/panel fanout technologies. The virtual platform removed the constraints of parallel sessions, and room size limitations, allowing attendees to watch the most relevant content on their own schedule. The conference was headlined by Sam Naffziger, AMD Senior Vice President, who gave a keynote to open the conference focusing on the impact of chiplet-based SOC architectures and manufacturing from a packaging perspective. Sam’s keynote was watched by over 550 attendees. The most watched technical session of the conference was Session 1: 2D and 3D Chiplet Interconnects in FO-WLP/PLP.
This year the conference included a record of 14 special sessions and panel sessions that combined deep dive discussions of technology developments, trends, and challenges. Following up on Sam Naffziger’s keynote, a panel of experts discussed the opportunities and challenges of chiplet designs and applications. The Plenary session, organized by Jan Vardaman, Kim Yess and Mark Poliks, brought together a panel of experts on the transformation of the electronics industry in a Post-COVID world. This panel presented their perspectives on the continued transformation of the industry and expectations that will drive packaging developments in the future.
Industrial partners continued their strong support of the ECTC mission again this year. Their participation allowed ECTC to create a rich global online destination for academics and industrial researchers to exchange of information and ideas on electronic packaging and integration technologies. The conference had a record 43 sponsors and 61 Technology Corner Exhibitors.
Looking forward, the 72nd ECTC will be held in San Diego, California, May 31- June 3, 2022.
The Call for Papers can be found at www.ectc.net. Abstract submission will close October 4, 2021. Plan now to attend for in-person sessions, and network with your colleagues!
Ibrahim Guven – 2021 ECTC Program Chair
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