II-VI and LITE-ON partner on volume manufacturing and marketing of packaged lasers for mass-market LiDAR

Engineered materials and optoelectronic component maker II-VI of Saxonburg, PA, USA has signed a strategic agreement with Taiwan-based optoelectronic component packaging firm LITE-ON Technology to partner on volume manufacturing and commercialization of packaged lasers for mass-market light detection & ranging (LiDAR).

The rapid proliferation of LiDAR in automotive, commercial and industrial applications is driving demand for low-cost lasers that can be manufactured in very high volumes. II-VI and LITE-ON aim to leverage their respective high-volume manufacturing platforms for semiconductor lasers and optoelectronic packaging to jointly commercialize over time a broad portfolio of lasers spanning from near-infrared (NIR) to shortwave infrared (SWIR), with the first product to launch in mid 2020.

II-VI is an established in highly reliable semiconductor laser diodes that serves a diverse range of end markets including communications, materials processing, aerospace & defense, life sciences and consumer electronics,” comments Sander Su, associate VP, OPS SBG, LITE-ON Technology. “By leveraging our deep experience in low-cost packaging and high-volume manufacturing, as well as our sales channels in automotive, commercial and industrial markets, we will be able to meet the window of opportunity for high-volume LiDAR applications,” he reckons.

LITE-ON leverages its global manufacturing footprint and sales channels to ship billions of light-emitting diodes each year in automotive and consumer electronics, making them an ideal partner for II-VI,” comments Dr Karlheinz Gulden, VP, Laser Devices & Systems business unit, II-VI. “We look forward to develop the most vertically integrated LiDAR laser sources on the market, driving our competitive leadership in terms of performance and value.

II-VI’s broad portfolio of products for LiDAR includes laser sources, filters, mirrors, lenses, windows and thermoelectric coolers. The firm is showcasing its portfolio of products for automotive applications at AutoSens 2019 in Brussels, Belgium (17-19 September).

Source: http://www.semiconductor-today.com/

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