Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison

4 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 36% on your package – Contact us!



Apple vs Samsung ALS comparison flyer cover, ambient light sensor

ALS and proximity sensor comparison for the latest three smartphone generations: Galaxy S7, S8 and S9 and iPhone 7, 8 and X.


Behind the screen, latest Apple’s smartphone has a better color management of the display than Samsung’s thanks to the Ambient Light Sensor (ALS), which allows better color management of the display. ams AG and STMicroelectronics are the leading suppliers of ALS and proximity sensors for consumers. Both are implicated in the supply chains of Samsung’s and Apple’s latest flagships. System Plus Consulting has conducted a comparative review of the ALS and Proximity Sensor in the latest three flagships smartphones from Samsung and Apple. We analyze and compare the Samsung Galaxy S7, Galaxy S8 and Galaxy S9 and the Apple iPhone 7, iPhone 8 and iPhone X. We provide insights into the structure, technical choices, design, processes, supply chain positions and costs.


Ambient light sensor smartphone, ALS flyer front image content web



Of the two OEMs, Samsung has chosen to combine the two sensors in a single component, whereas Apple made the choice to keep them separate. Over the years, Samsung has improved the performance without changing its packaging footprint. Apple has kept the same supplier, STMicroelectronics, for its proximity sensor. However it has added features to each new generation, as in the latest the iPhone X, where the proximity sensor is combined with a flood illuminator. In this new iPhone the ambient light sensor is still supplied by ams, but has a multi-spectral feature.

This report includes an analysis of the packaging and the sensor die along with a cost analysis calculation for all the devices. Finally, we compare device evolution by OEM and a cross-comparison to highlight their choices.


  ALS, Proximity Sensor Samsung Galaxy S9 image3 Multi Spectral Sensor Die Overview iPhone X image2 Ambient light sensor iPhone, ALS iPhone 7 image4












Table of contents


> Executive Summary

> Devices Analyzed

> Reverse Costing Methodology



Structure, Process and Cost Review

> Samsung

- Galaxy s7

  • Color sensor and proximity sensor

- Galaxy s8

  • Color sensor and proximity sensor

- Galaxy s9

  • Color sensor and proximity sensor

- Samsung evolution


















































> Apple

- iPhone 7

  • Ambient light sensor
  • Proximity sensor

- iPhone 8

  • Color sensor
  • Proximity sensor

- iPhone X

  • Multi-spectral sensor
  • Proimity sensor and flood illuminator

- Apple evolution






System Plus Consulting Services


About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at 




















































  • Package Views and Dimensions
  • Package Cross-Sections
  • Precise Measurements
  • Die Descriptions
  • Technology Description
  • Cost Analyses
  • Cost Comparisons