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FLIR Boson – a small, innovative, low power, smart thermal camera core
Sep.2017

yole_flir_boson_optics_ir_camera_system_plus_consulting
3 490 €

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Description

flyer cover flir boson yole

An infrared camera with a powerful vision processor in a small package, using a new 12µm microbolometer 

 

Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. 

Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost.


The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.


The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor.

Yole FLIR Boson Optics IR Camera System Plus Consulting



The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.

 

The thermal camera uses 12µm pixels based on a vanadium oxide technology microbolometer, the ISC1406L, which features a 320x256 resolution and wafer-level packaging (WLP) to achieve a very compact design. The die is half the size of the one in the oldest ISC0901 model, but gives the same definition.

 

This report is divided into two parts. One is focused on the microbolometer, and the other on the camera system.


The first report provides a detailed teardown and cost analysis of the microbolometer, lens and WLP. The second report provides the bill-of-material (BOM) of the camera core, and manufacturing cost of the infrared camera.

 

Yole FLIR Boson Bolometer Analysis IR Camera System Plus Consulting


The reports also include two comparisons between the characteristics of the FLIR ISC1403L, FLIR Lepton 3 and the PICO384P from ULIS.

 

One comparison highlights differences in technical choices made by the companies. The second comparison looks at changes in FLIR’s technological choices for its camera core.

 

Yole FLIR Boson Bolometer IR Camera System Plus Consulting

Table of contents

FLIR ISC1406 MICROBOLOMETER 


 

Overview / Introduction

 

Company Profile

 

Physical Analysis


> Overview and Methodology
> Package
> Window
> Microbolometer
> ROIC

 

 

Comparison


 

Manufacturing Process Flow


> Overview
> ROIC Front-End Process and Wafer
> Fabrication Unit
> MicrobolometerProcess Flow
> Window Wafer Fabrication Unit
> Packaging Process Flow

 

Cost Analysis


> Summary of the Cost Analysis
> Yield Explanation and Hypotheses
> ROIC Front-End Cost
> Microbolometer
> Window
> Component
- Bonding front-end cost, IR sensor wafer and die cost, Back-end: final test cost and Microbolometercomponent cost

 

 Estimated Price Analysis

 

 

 

 

 

 

FLIR BOSON CAMERA 


 

Overview / Introduction

 

Company Profile

 

Physical Analysis


> Views and Dimensions of the System
> System Opening
> Optical Element Cross-Sections
> IR Sensor Board
> Vision Processor Board
> FLIR Technological Comparison

 

 

Cost Analysis 


> Accessing the BOM
> PCB Cost
> MicrobolometerCost
> BOM Cost –Vision Processor Board, IR
> Sensor Module and Housing
Material Cost Breakdown by Component Category
> Accessing the Added Value (AV) Cost
> Electronic Board Manufacturing Flow
> Details of the Electronic Board AV Cost and of the Housing AV Cost
> Manufacturing Cost Breakdown for 10k units

 

Estimated Price Analysis

  

 

 

 

 

 

 

 

 

 

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Material analysis

  • Comparison between FLIR and ULIS microbolometers

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price