Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Xiaomi Mi 8 Explorer Teardown and Identification of Key Components

1 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 36% on your package – Contact us!



Xiaomi MI 8 Explorer Teardown and identification

Discover Xiaomi’s latest flagship Key devices, technical choices on 3D Sensing and main suppliers to compete against Apple’s iPhone X/Xs/Xr.


With the introduction of the iPhone X in September 2017, Apple set the technology standard in consumer products. One year later, Xiaomi, a rapid-growing Chinese player, is putting its answer to Apple’s iPhone X on the market.



Xiaomi MI 8 Explorer Teardown


The progress made by Xiaomi over the last five years is impressive. Its latest flagship state-of-the-art technology can compete strongly in China, where Apple is still struggling to increase its market share. Its main innovation is the integration of a structured–light based 3D imaging module, as well as under-display fingerprint sensing technology.

The report includes teardown photos, detailed package identification and descriptions. It is supplied with an Excel file summarizing the Mi 8 Explorer chipset and the assignments by supplier, package or footprint. It will help you to identify the manufacturer, the packaging size, type and pitch as well as the function of the 85 ICs in the Mi 8 Explorer.


  structured–light based 3D imaging module Xiaomi MI 8 Explorer Teardown report Xiaomi MI 8 Explorer Teardown technology report

























Table of contents


> Executive Summary



Physical Analysis

> Views and dimensions of the Mi 8 Explorer
> Mi 8 Explorer Teardown
> Electronic boards high definition photos
> Main component markings and package identification: type, dimensions, pitch, pin count
> PCB surface area, cross sections and minimum line width
> IC package distribution
> IC manufacturer design wins
> IC package footprint










































































About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at 







































































  • Smartphone teardown

  • Integrated circuits identification, including marking, manufacturer, reference,function, package type, size and pin count

  • Printed circuit board characteristics, including cross-section and minimum line width

  • Assignment graphs