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Imaging

Through-silicon via (TSV) market growth was initially driven by backside illumination (BSI) CMOS image sensors (CIS), but this is now under threat. However, in the next few years growth will ride a fresh wave of TSV interconnect adoptions in new areas like fingerprint and ambient light sensors as well as 3D stacked memory applications, according to recent Yole Développement's report, Equipment and Materials for 3D TSV Applications 2017.

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Semiconductor foundry to leverage revolutionary wafer bonding And 3D interconnect technology for Advanced Image Sensor solutions.
Semiconductor Manufacturing International Corporation (SMIC), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi.

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NST Series provides non-contact full field profilometry to 0.1nm resolution; Delivers unique Ooerlay solution for hybrid bonding. UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai.

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STATS ChipPAC, a provider of advanced semiconductor packaging and test services, announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).  In high volume production for over seven years, STATS ChipPAC has led the industry in FOWLP technology innovations and unit shipments.

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Semiconductor foundry to leverage revolutionary wafer bonding and 3D interconnect technology for Advanced Image Sensor solutions
Semiconductor Manufacturing International Corporation (SMIC), the 
global semiconductor foundries and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi.

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Industry adoption of SPTS’s plasma dicing solution further verified by System Plus Consulting ‘Teardown’ analysis of MEMS microphones in iPhone 7 Plus. Orbotech announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic™ Plasma Dicing System from JCAP (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies.

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Upcoming Events


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(April 24 - April 26, Dusseldorf, Germany)

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(September 7 - September 7, Shenzhen, China)