IQE announces the world’s first commercially available 200 mm (8”) VCSEL wafer

  • Enables the expansion of the 3D sensing market beyond the smartphone
  • Based on IQE’s patented 200mm technology for Wireless and Photonics compound semiconductor applications

IQE plc (AIM: IQE, “IQE” or the “Group”), the supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry, is pleased to announce the world’s first commercially available 200 mm (8”) VCSEL epiwafer.

IQE is the compound semiconductor industry in the development of 200mm epiwafers for wireless, sensing and display markets. IQE’s 200mm epiwafers will enable a step-change in unit economics for compound semiconductors, to the expansion of the market for IQE. The increase in wafer size will expand to new foundry partnerships, including Silicon-based foundries. Furthermore, it enables the integration of compound semiconductors on silicon, allowing adoption across a wider range of devices and applications.

IQE’s 200mm VCSEL development is an example of the Company’s continued innovation with the aim of expanding the market for wireless and 3D Sensing. 3D Sensing was made economical within premium smartphones in 2017 when IQE developed and scaled VCSEL epiwafers from 100mm to 150mm. The introduction of 200mm creates opportunities beyond the smartphone, into a broad range of intelligent connected devices and also enabling applications in the Metaverse.

Americo Lemos, Chief Executive Officer of IQE, commented:

This is a critical milestone and establishes IQE as the global leader in scaling compound semiconductor technology to larger diameters. As we set out in our FY21 Results in March, a key focus area is growing our business by extending our roadmap to 200mm to establish new foundry partnerships. This advancement will expand the market for both Wireless and Photonics applications and service the growing demand for compound semiconductors as macro trends such as 5G and the Metaverse proliferate and capture more value for our technology.”


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