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Vkansee, creator of the world’s first under-glass and most secure, patented and ultra-thin optical fingerprint sensor, announced a prototype laptop integration for the world’s first under-glass optical fingerprint sensor compatible with Windows operating systems.

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BADGE SPONSOR - ULIS

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ULIS, a subsidiary of Sofradir, specializes in the design and manufacture of high quality thermal image sensors for commercial applications. It enables makers of consumer electronics and infrared equipment to produce low weight, low power consumption and cost-effective thermal cameras for everyday use. ULIS is the second largest producer of thermal image sensors (microbolometers). It offers a targeted range of microbolometers that are the key component of many top brands in thermal imaging equipment sold across Europe, Asia and North America. ULIS is active in the thermography and firefighting markets. Professionals are increasingly choosing thermal imaging devices equipped with ULIS’ products due to the excellent performance of ULIS’ technology and its affordability for mainstream commercial applications. Size, weight, low power consumption and cost reductions drive ULIS innovations, enabling the company to address new trends in smart buildings, road safety and in-cabin comfort of vehicles. ULIS is located in Veurey-Voroize, near Grenoble. www.ulis-ir.com

 

 Lighting Technologies Reports Bundle

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Why and how is LED's added value moving into LED modules and lighting applications?

The evolution of the LED supply chain is pushing the value from the LED to LED modules, in order to adapt light generation to applications. The module includes all of the thermal management, as well as the optimisation in terms of light extraction and the use of the extracted light, so more and more value is appearing at the module level, in addition to new possibilities coming from OLED technologies (i.e. light-emitting structures in 2D), UV LED (i.e. for water purification), and new usages for IR LED in areas like motion sensing and infrared imaging.

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Choose a minimum of three reports from Yole Group of Companies (including Yole Développement, System Plus Consulting and KnowMade) and receive a discount of at least 39% on your package - Contact This email address is being protected from spambots. You need JavaScript enabled to view it.

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are available to you in all our domains: MEMs & Sensors, Advanced Packaging, Imaging, Medtech, Photonics, LED, Manufacturing, Power electronics, Compound Semi, Battery & Energy management. 

 

 

 RF for Telecommunications & Sensing Reports Bundle

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radio frequency idWireless technologies are becoming more diversified, and so too their applications. How best to understand what's happening?

Wireless communication's abilities are becoming ubiquitous, from mobile applications (mobile phones, tablets, wearables, etc.) to infrastructure (base stations, in-car communications, WiFi, IoT). With the proliferation of standards and specific infrastructure needs, RF devices and modules must be increasingly integrated, mixing different technologies like silicon, SOI, MEMS, and GaN with complex packaging such as embedded die, FO, WLP, and SiP, along with architectural changes. It's the perfect time for Yole Développement to enter these fields!

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Choose a minimum of three reports from Yole Group of Companies (including Yole Développement, System Plus Consulting and KnowMade) and receive a discount of at least 39% on your package - Contact This email address is being protected from spambots. You need JavaScript enabled to view it.

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 RELATED WEBCAST

In the midst of the RF industry’s transformation, a closer look at power amplifiers
July 21st at 5:00 PM CET / 8:00 AM PDT - Organized by Yole Developpement

Power amplifier (PA) modules are key to any RF system. To address increasing demand for spectral and power efficiency, innovative solutions are being deployed, including GaN and advanced filter technologies. Based on Yole Développement's most recent analyses and System Plus Consulting's latest teardowns, the Yole Group of Companies offers an in-depth assessment of the technology and market trends affecting the RF PA and filter industries. Access the archive here.

 

Samsung Electronics, the world leader in advanced memory technology, announced that it is now mass producing the industry’s first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. The newly introduced embedded memory features outstanding performance for mobile devices that exceeds that of a typical SATA-based SSD for PCs.

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