All equipment markets are growing to reach US$2.4 billion in 2026, driven by lithography and bonding processes.
“Without a doubt, 2020 was a difficult year for device manufacturers.” asserts Taguhi Yeghoyan, PhD., Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole). She adds: “Chip demand soared mainly in the consumer market due to lockdowns and working from home. Despite the cash injection, manufacturers could not keep up with increased demand. Massive fab expansions and equipment orders followed.”
Production was held up worldwide due to the COVID-19 pandemic, lockdowns and climate and accident-related issues. All these aspects generated chip shortages across all markets. Governments and the public realized the semiconductor industry’s importance in everyday life and national sovereignty. As such, private and public manufacturing giants rushed to increase production volume, announcing fab expansion or new locations, while governments increased industry incentives worldwide.
In this context, Yole investigates disruptive patterning and bonding technologies and related markets in depth, to point out the latest innovations and underline the business opportunities.
Released today, the Lithography and Bonding equipment for More than Moore 2021 report provides an overview of photolithography and permanent as well as temporary bonding equipment for MtM device manufacturing and associated state-of-the-art and emerging processes. It also proposes an in-depth understanding of the lithography and bonding ecosystem. Including market trends and forecasts, supply chain, technology trends, technical insights and analysis, take away and outlook, this study also delivers an in-depth understanding of the ecosystem and main players’ strategies.
What are the economic and technological challenges of the lithography and bonding industry? What are the key drivers? Who are the equipment manufacturers to watch, and what innovative technologies are they working on?
Yole presents today its vision of the lithography and bonding equipment industry for MtM devices.
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