3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVS have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
TSV technology: a key platform for heterogeneous integration
The market for TSV technology will continue to grow, with a CAGR exceeding 10% over the next five years, helped by the next wave of adoptions. These include AMD’s introduction of high-bandwidth memory (HBM) in its high-end graphics cards, and Intel’s launch of its Knights landing processor, which features a variant of Micron’s hybrid memory cube (HMC). Meanwhile, Apple’s latest smartphones implement TSV technology in FPS.
Both AMD and Nvidia have announced new graphics products exploiting next generation HBM2 technology. Other announcements include networking OEMs such as Cisco and Juniper Networks with switches and routers integrated with HMC and HBM technology. And memory suppliers SK Hynix, Samsung and Micron have already announced the specification for third generation HBM3 and HMC3.
Another important market is 3D stacked (3DS) memory, also known as 3D DDR4, for servers. Yole believes that the market share of 3DS could surpass other 3D memories in next 10 years. Samsung and SK Hynix are already in high-volume manufacturing with 3DS products and Micron too will soon enter this market.
With the adoption of HBM in GPU graphics products, silicon interposers are becoming an asset for the integration of components with small feature sizes. Silicon interposers are the key substrates for heterogeneous integration of at least one logic IC with memory die and even possibly mixed signal or analog ICs. The main applications are GPUs, integrating logic and memory, FPGAs for die partitioning, and large ASICs for high end applications. The main remaining issue with silicon interposers is the cost. Currently the cost of silicon interposers with TSVs is still in the $1000 range, but it is trending downwards towards becoming accessible for manufacturing. Samsung has newly entered the silicon interposer market, joining the few other suppliers of high density interposers below 1µm L/S, TSMC, Global Foundries and UMC. UMC is the key supplier for AMD’s graphics products. Other players are looking for alternative TSV-less technology that provides similar interconnect density to silicon interposers, such as Amkor’s SLIM, SPIL’s SLIT, Intel’s EMIB, and Shinko’s iTHOP.
Avago is the key supplier for RF BAW filters that use TSV technology. The number of filters per smartphone will increase to around 35 by 2020. Along with the migration to 4G/5G networks, this will keep demand for BAW filters high.
TSVs have also penetrated new sensor applications, driven mainly by FPS and Ambient Light Sensors (ALS) for mobiles and wearables. As well as the FPS using TSV technology in the latest iPhone, ams launched the smallest ALS yet manufactured using TSV technology. Applications like photonics will most probably see this technology in products coming onto the market in the next four years. The report will describe all the different products, their specifications, requirements and main challenges.
Will 3D TSV open the doors for new packaging strategies
All the top Outsourced Semiconductor Assembly and Test (OSAT) companies have the 3D/2.5D Mid-End-of-Line (MEOL) assembly capability but the actual utilization rate is very low. Amkor in particular has invested heavily in 3D/2.5D MEOL but their investment has not paid off yet. The key reason is that it has focused mainly on the 2.5D assembly and the market is still limited, although Yole is starting to see some production.
For 3D stacking, memory companies have in-house assembly capabilities, although Amkor is trying to get memory stack business from SK Hynix. OSATs are moving into MEMS and sensor assembly, which has higher volume, for example with ASE doing via-last TSV assembly of various MEMS sensors.
With foundries also offering turnkey solutions where they partner with OSATs to provide complete 3D/2.5D assembly, this technology is opening the door to a different manufacturing ecosystem. The report will discuss the various business models and strategies of OSATs and foundries to increase their market share for TSV applications. It will also provide detailed analysis of the supply chain for key products and players.
- Updated wafer forecast for 3D memory, CMOS image sensors (CIS), MEMS and other sensors
- Updated revenue and unit forecast for 3D memory, CIS, MEMS and sensors and all applications using TSVs
- Updated market adoption roadmap for 3D/2.5D products
- Forecast for new 3D TSV applications such as fingerprint sensors (FPS), ambient light sensors (ALS), LEDs, silicon photonics, radio frequency, etc.
- Supply chain for various 3D/2.5D devices
- Section added for OSAT companies and foundries involved in 3D/2.5D TSV packaging
- TSV products benchmarking
- Teardowns of key products
- Alternative TSV-less packaging technology
Objectives of the Report
This report’s objectives are to:
- 3D/2.5D IC packaging technology and market trends by application
- Wafer forecast for 2015-2021 for different TSV applications in $, units and number of wafers
- Market status of current and future 3D IC products
- Technology roadmap by device
- New TSV technology application areas
- Overview of key players and supply chain activities
- OSAT and foundry strategies