Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Samsung Galaxy S6 teardown & physical analysis of key components

2 490 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 36% on your package – Contact us!


GS6 Review flyerDiscover and understand Samsung’s technical choices and main suppliers

The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 “noteworthy” components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.


GS6 Review icon 


MEMS/Sensors components

  • Fingerprint sensor - second generation
  • eCompass - new reference which has never been used in a smartphone and smallest eCompass on the market
  • OIS gyroscope - smallest gyroscope on the market
  • Heart-rate monitor sensor and color, ambient light and proximity sensor - rarely integrated in a smartphone

Imaging components

  • Front and rear camera modules
  • Flash LED

Packaging components

  • Samsung Exynos Processor - advanced Package-on-Package (PoP) structure
  • Samsung power management IC - smallest pitch Wafer-Level Package (WLP) on the board

RF component

  • Wi-Fi & Bluetooth combo module - flip-chip BGA SiP integrating the industry’s most powerful 5G WiFi combo chip

 GS6 Review img3


Table of contents

Executive Summary


Reverse Technology Methodology


Samsung Galaxy S6 Teardown


Electronic Board

  • High Resolution Pictures
  • ICs Identification

> ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
> Unknown Components Decapsulation
> Repartition by package type
> Mfr. Design wins ranking
> ICs footprint ranking

  • PCB Characteristics

> PCB Cross-Section
> PCB min. line width


Advanced Packaging

  •  Samsung Exynos PoP

> Package views & dimensions
> Package Cross-Section
> Package Opening
> Processor & DRAM dies measurement

  • Samsung smallest pitch WLP

> Package views & dimensions
> Package Cross-Section



  •  Fingerprint Sensor

> Button Assembly View
> Fingerprint sensor views & dimensions
> Fingerprint sensor
> Cross-Section Sensor die measurement

  • 3-Axis eCompass

> Package views & dimensions
> Package Cross-Section
> Die measurement
> Sensor Details

  • OIS Gyroscope

> Assembly in camera module
> Package views & dimensions
> Package Opening & Die measurement
> MEMS opening & sensor details
> Cross-Section

  • Pulse Oximetry & Heart-Rate Monitor Sensor

> Package views & dimensions
> Package Opening & Die measurement

  • Color, ALS and Proximity Sensor

> Package views & dimensions
> Package Opening & Die measurement



RF Devices

  • 5G Wi-Fi & Bluetooth Combo Chip

> Package views & dimensions
> Package Opening & Dies measurement


Camera Modules & Flash LED

  •  16Mp Rear Camera Module

> Module views & dimensions
> Module Opening & CIS die measurement
> Module Cross-Section

  • 5Mp Front Camera Module

> Module views & dimensions
> Module Opening & CIS die measurement
> Module Cross-Section

  • Flash LED

> Package views & dimensions Package
> O
pening & LED die measurement


System Plus Consulting

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.


  • Smartphone teardown

  • ICs identification (manufacturing, reference, function, packaging type, size & pin count)

  • PCB characteristics (cross-section, min. line width)

  • Physical analysis (decapsulation, cross-section, optical & SEM pictures, measurement)