Description
Note from the publisher: The report will be available starting on December 19, 2018.
OSATs are gaining benefits from advanced packaging in automotive.
PACKAGING DEDICATED TO AUTOMOTIVE ELECTRONICS IS GROWING AND WILL REACH $7B IN 2023
The automotive market grew by 7% in revenue in 2017, while semiconductor technology in the automotive market is growing by 20%. Electronic devices are more and more common in cars and the number of electronic systems is also increasing. The quantity of electronics in a car has increased 2.5 times since the 90’s; in 2017, 26 cm² of semiconductor substrates was used in a car, while in 2023 we expect 35 cm². Four main trends are leading this augmentation, electrification, autonomy, connectivity and comfort. All of them involve a large number of sensors, power supplies, communication chips, lighting components and processors that can come from the consumer market or be developed specifically for automotive. This increase in electronic devices in cars will drive the packaging market. In fact, in 2017, the packaging for automotive total revenue was quoted at ~$3.7B and it will reach ~$7B in 2023, including LED module. The automotive packaging industry is involved in many device types and thus in many packaging platforms. In the report,you will find detailed scenarios for growth of the market with a breakdown by packaging platform and automotive application, such as radar, LiDAR, power devices, lighting and photonics.
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DESPITE THE HIGH DEGREE OF REGULATION, CONSUMER PACKAGING TYPES ARE SLOWLY ADAPTED TO, AND ADOPTED BY, THE AUTOMOTIVE MARKET
The automotive industry is highly regulated, due to concerns about safety and pollution. Due to all the specifications required for each component, new device development takes a long time for qualification. This obstacle is a limitation in terms of use of new types of packaging. More-over, the automotive industry is not the most receptive for innovations in packaging. But we are entering a new era for automotive development that may accelerate things. There are significant demands for power applications that can drive innovation. A second wave could be led by increasing autonomy and connectivity. It is important also to notice that is the first time in history that a big effort is made to adapt consumer technologies to automotive to drive innovation in dedicated applications such as powertrain. Although the main platform interm of units is the Wire Bond Ball Grid Array (WBBGA) package, which represents half of the market, advanced packaging platforms such as flip-chip and fan-out are finding their place. The next innovation expected is embedded die in substrate for converter dies. Packages like Quad Flat No-leads package (QFN), Interstitial Ball Grid Array Package (iBGA) and ceramic packaging are also growing for specific applications like CMOS Image Sensors (CIS), MEMS and power devices. You will find details on all the types of packages used in the automotive industry, technology road maps and a market analysis for each of them.
THE BIG WINNERS OF DIVERSIFICATION AND THE INCREASE OF ELECTRONICS IN THE AUTOMOTIVE MARKET ARE THE OSATS
Players in the advanced packaging industry for automotive can be split into two groups, the IDMs/ Tier 1 and the OSATs. IDMs and Tier 1 are the main suppliers of the car OEMs for integrated systems, and OSATs specialize in the initial packaging and testing. Automotive packaging was mostly done in-house by IDMs and Tier 1, as it allows an easier integration and a faster development of systems. As ever more electronics are implemented in cars, more and more outsourcing goes to OSATs. In the past, OSATs supplied relatively little of the electronic advanced packaging for the automotive market, while today OSATs represent 38% of the total revenue for advanced packaging for cars and this proportion might keep growing. This change has been made possible due to the increasing quantity of devices, diversification of components, the increased complexity of the packaging and there liability of specific manufacturers. Moreover, some devices come from the consumer market that OSATs already supply. Currently, Amkor and ASE represent more than 80% of the automotive advanced packaging for automotive supplied by OSATs. In 2015, Amkor acquired J-Devices, one of the larger Japanese OSATs. Thanks to this acquisition and new brand positioning focused on the automotive market, Amkor is now the top OSAT in automotive packaging with more than 50% of the market, followed by ASE and STATS ChipPAC.
OBJECTIVES OF THE REPORT
- Identify and analyze the major advanced packaging platforms currently used in the automotive industry
- Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting devices, MEMS and sensors…
- Understand the impact of automotive regulations and specifications on packaging development
- Present a detailed technology roadmap for advanced packaging platforms for automotive applications
- Identify the market drivers, disruptions and business opportunities
- Analyze key benefits and added value of emerging advanced packaging platforms
- Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive landscape
- Give an overview of who is doing what, and specificities of each market segment
