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Manufacturing

The newly acquired Cando Corporation assets will allow Micron to centralize fabrication and back-end in a single location.Micron Technology, a global leader in advanced semiconductor systems,announced that on March 14 it successfully won the auction for Cando Corporation assets, which will be utilized in establishing a back-end site for Micron Taiwan. Micron has now completed the title acquisition process for the new site.

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The silicon wafer manufacturer Okmetic Oy announces a major investment to develop the technical capabilities of its Vantaa plant. The upgrade will enable the plant to manufacture C-SOI wafers and other demanding wafers. The company, which was acquired by the Chinese National Silicon Industry Group (NSIG) last year, has committed €40 million to the development of the Vantaa plant.

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Through-silicon via (TSV) market growth was initially driven by backside illumination (BSI) CMOS image sensors (CIS), but this is now under threat. However, in the next few years growth will ride a fresh wave of TSV interconnect adoptions in new areas like fingerprint and ambient light sensors as well as 3D stacked memory applications, according to recent Yole Développement's report, Equipment and Materials for 3D TSV Applications 2017.

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ULVAC,has developed a dry etching system for Descum processes and applicable to 600mm advanced packaging substrates.

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Samsung Electronics, a pioneer in advanced semiconductor technology, announced that its production ramp-up of the 10-nanometer (nm) FinFET process technology is on track with steady high yield to meet customer needs on schedule.

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NST Series provides non-contact full field profilometry to 0.1nm resolution; Delivers unique overlay solution for hybrid bonding. UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai.

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