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Manufacturing

Atotech is one of the global actors of specialty chemicals and equipment manufacturing. With its innovative solutions it is at the forefront of customer needs and market developments. Sustainable solutions, cost-effective products and processes and technological leadership help tackle the industry’s challenges, such as the increasing cost pressures within the PCB HDI industry.

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SK Hynix introduced the industry’s first 72-Layer 256Gb(Gigabit) 3D(Three-Dimensional) NAND Flash based on its TLC(Triple-Level Cell) arrays and own technologies. The Company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB(Gigabytes) storage. SK Hynix launched 36-Layer 128Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. In just 5 months, the Company has developed the 72-Layer 256Gb 3D NAND chips, securing the industry’s finest product portfolio.

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Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, and Cypress Semiconductor, a provider of embedded nonvolatile memory solutions, announced the production of low power embedded flash, aimed at the growing market of IoT and the other low power micro-controller unit (MCU) applications, using HLMC's 55-nanometer(nm) low-power (LP) process technology with Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded flash memory intellectual property (IP).

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Kulicke & Soffa Industries, announced the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

The 180 square meter laboratory adds to the Company's existing base of global application facilities. The Netherlands site uniquely houses a complete prototype assembly line of K&S Advanced Packaging and Electronics Assembly equipment.

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2016 was a turning point for fan-out packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution (1), the market changed. Thus advanced packaging leaders decided large investments for the development of fan-out platforms, impacting the related equipment and materials market.

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Advanced Packaging & System Integration Technology Symposium – April 20&21, 2017 – Wuxi, China | 2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions. “And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on i-micronews.com.

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