More than Moore devices: the wind of change

Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Semiconductor companies are today looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.

More-than-Moore devices (including MEMS & sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.

Between 2017 and 2023, the wafer demand for More than Moore devices is showing an impressive 10% growth (Wafer demand – 8-inch eq.). This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications, performed by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure & mobile segments, mobile including additional functionalities, voice processing, smart automotive & electrification, AR/VR, and AI… Full article


Free webcast on June 28 at 5:00 PM CEST – 8:00 AM PDT :  “Wafer Starts for More than Moore Applications – Webcast”.

This week, Yole invites you to an overview of the Wafer Starts for More Than Moore Applications report during the exclusive online event, titled “Wafer Starts for More than Moore Applications – Webcast”. This webcast takes place on June 28 at 5:00 PM CEST.

Amandine Pizzagalli, Technology & Market Analyst, Equipment & Materials – Semiconductor Manufacturing at Yole, will present key results of this report including megatrends, wafer market evolution, technical trends…

Moderated by David Jourdan, Sales Coordination & Customer Service at Yole, it welcomes the two leading companies, SPTS (an Orbotech Company) and Corning Precision Glass Solutions:

  • “Trends in Wafer Processing Technologies for RF MEMS” – Speaker David Butler, Executive Vice President and General Manager at SPTS Technologies
  • “Benefits of Through Glass Vias for RF applications” – Speaker: Ravij Parmar, New Product Development Manager for Corning Precision Glass Solutions


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