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For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017. Discover below the preliminary agenda.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 - Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE
Herb Huang, SMIC

9:45 – 10:10 – Fan Out Packaging Market Trends
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution
Lewis Kang, Global Marketing Unit., Director, nepes Corporation


10:35 AM – 11:20 AM: Coffee Break and Networking


11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape
Jérôme Azemar, Market & Technology Analyst, Yole Développement


12:10 PM – 1:45 PM: Lunch and Networking


1:45 PM – 3:25 PM: Session #2 - 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors
Dr Wenqi Zhang, Technical Director, NCAP



3:25 PM – 4:10 PM: Coffee Break and Networking


4:10 PM – 5:25 PM: Session #3 - Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?

6:30 PM – 6:45 PM: Thank You and Adjourn

6:45 PM – 8:00 PM: Networking Cocktail


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 - Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Temporary Bonding for FOWLP and Advanced Packaging
Dr. Thomas Uhrmann, Business Development Director, EV Group

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

 

11:00 AM – 11:45 AM: Coffee Break and Networking

 

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

12:35 PM – 2:00 PM: Lunch and Networking


2:00 PM – 4:15 PM: Session #5 - Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module 
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


4:25 PM – 4:30 PM: Thank You and Adjourn

Download PDF files: AGENDA - SPEAKERS BIO - ABSTRACTS

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