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Advanced Packaging

Navitas Semiconductor, the industry’s first and only GaN power IC supplier, has announced major manufacturing partnerships with TSMC and Amkor to support significant customer demand for 2018 & beyond. Since the introduction of the company’s GaN power IC platform last year, the market response has been extraordinary as customers move quickly to adopt the technology.

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The emerging 5G wireless communication standard will bring wholesale change, from services to device technologies shaping new wireless infrastructure, and in the associated supply chain. Yole Développement (Yole) now highlights the technology and market trends 5G is driving in one new report: “5G’s impact on the RF front-end industry: How will wireless infrastructure and cell phone terminals change in the next decade?”. Yole also explores how the system-in-package (SiP) platform will enable such changes in an accompanying report, “Advanced RF System-in-Package for Cell Phones”.

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Skorpios Technologies, a System on Chip (SoC) company, today announced that it has acquired Novati Technologies, a semiconductor integration company and fab located in Austin, TX. The acquisition closed on Oct. 2, 2017 for an undisclosed amount. The combined corporation will be called Skorpios Technologies.

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The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications and services. One of the key drivers for developing such speed is high resolution video demand (4K, 8K etc.) over mobile devices.

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Integra Technologies, a world actor in integrated circuit test and related services, announced that it has acquired CORWIL Technology. CORWIL provides high quality and responsive semiconductor die prep, assembly and test services focusing on Hi-Rel, fast-turn, and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

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ams, a worldwide supplier of high performance sensor solutions, announced the expansion of its manufacturing operations in Singapore at JTC nanoSpace @ Tampines. ams will operate a fully automated clean room with state-of-the-art filter deposition technology for high-precision, best-in-class micro-optic sensors. Alongside this, ams will also invest in a new VCSEL (Vertical Cavity Surface-Emitting Lasers) R&D and manufacturing line.

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Upcoming Events

> IWLPC – International Wafer-Level Packaging Conference
(October 24 - October 26, San Jose, USA)

> IMPACT 2017 | 12th International Microsystems, Packaging, Assembly and Circuits Technology
(October 25 - October 27, Taipei, Taiwan)

(November 8 - November 10, Atlanta, GA)

Latest Reports


Advanced Packaging Industry 2017
Discover the presentation held by Andrej Ivankovik at ASE Forum Tech, on June 28th 2017, in ...
3D and 2.5D Technology: Current Adoption, Market Trends & Future Challenges
Discover the presentation held by Emilie Jolivet at MinaPAD, in Grenoble, France on May 2017.
Where is Advanced IC Packaging Technology Heading: Key Trends & Business Update
Discover the presentation held by Santosh Kumar at SEMICON South East Asia, in MITEC, Kuala ...

Access to all our presentations