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Advanced Packaging

Artificial Intelligence (AI) is a major trend for multiple applications, disrupting industries in each one. But this brings key questions. One concerns the partitioning of whether AI hardware or software firms will benefit most from adding value.

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In its “BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences & Healthcare 2018” report Yole Développement describes how MEMS devices and emerging sensors are becoming key solutions transforming global healthcare.

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The use of ultrasound for industrial and medical applications has a long and colorful history. Starting in 1965, the commercial potential of ultrasound took off, particularly for medical uses. Today, many different industries benefit from the advancement of ultrasound technology.
The ultrasound industry is stable and mature, with key markets such as non-destructive testing, automotive and medical constantly delivering new technological developments. But new consumer markets such as fingerprint sensors for smartphones and gesture recognition are now looking at this technology, injecting vibrancy.

Yole Développement’s (Yole) describes in the “Ultrasound Sensing Technologies for Medical, Industrial and Consumer Applications” report how the ultrasonic transducer ecosystem will evolve, and how Micro-machined ultrasound transducer (MUT) technologies will rapidly penetrate the ultrasound market.

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The expansion reinforces Amkor's manufacturing capability in Taiwan - Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.

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Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies. Xperi Corporation is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas ZiBond® and Invensas DBI® 3D semiconductor technologies.

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Flex has entered into an agreement with Multi-Fineline Electronix (“MFLEX”), a wholly-owned subsidiary of Suzhou Dongshan Precision Manufacturing (“DSBJ”), to divest the China-based operations of the Flex subsidiary, Multek. According to the terms of the agreement, upon closing, MFLEX will acquire all of the equity interests in the non-US subsidiaries of Flex that operate the China-based business of Multek, for proceeds of approximately $273 million, net of cash. Multek will continue to operate with its current name and location in Zhuhai, China.

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Upcoming Events


> 20th Electronics Packaging Technology Conference 2018 (EPTC)
(December 6 - December 9, Singapore)

> IC & Sensor Packaging Technology EXPO - 2019
(January 16 - January 18, Tokyo, Japan)

Presentation

Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...
High End Performance Application key Driver for Advanced Packaging
Discover the presentation held by Emilie Jolivet, Division Director, Semiconductor & Softwar...

Access to all our presentations