Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Advanced Packaging

“The introduction of products by big players, the emergence of new SCM applications and the entry of the top 5 logic foundries will drive the market,” announces Santosh Kumar, Senior Technology & Market Analyst at Yole Développement (Yole).

The “More than Moore” market research & strategy consulting company, Yole releases this week the Emerging Non-Volatile Memory report, 2017 edition. Under this update, the company presents an overview of the semiconductor memory market and a deep understanding of the emerging NVM applications. Forecasts of each market segment and detailed analysis of each NVM technologies are detailed in this report.

Read more ...

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications.

Read more ...

Mentor, a Siemens business, announced the industry’s most comprehensive and productive solution for advanced IC package design, the Xpedition High-Density Advanced Packaging (HDAP) flow. This comprehensive end-to-end solution, from rapid prototyping to GDS signoff, combines the Mentor Xpedition, HyperLynx, and Calibre technologies. The new Mentor IC package design flow delivers faster, higher-quality results compared to existing HDAP methodologies and technologies. The Xpedition HDAP design environment.

Read more ...

“We have entered a time when MEMS and semiconductor-based sensors, combined with increasing processing power, will bring exciting new applications such as AR/VR , autonomous vehicles, 3D sensing, and 5G communications,” explains Dr Eric Mounier, Sr Technology & Market Analyst at Yole Développement (Yole).

Read more ...

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Market Analyst at Yole.

Read more ...

Mentor, a Siemens business, announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs. By launching this program, Mentor will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced Amkor Technology as its first OSAT Alliance member.

Read more ...

Upcoming Events

> System-in-Package (SiP) 2017
(June 27 - June 29, Sonoma, USA)


No events


3D and 2.5D Technology: Current Adoption, Market Trends & Future Challenges
Discover the presentation held by Emilie Jolivet at MinaPAD, in Grenoble, France on May 2017.
Where is Advanced IC Packaging Technology Heading: Key Trends & Business Update
Discover the presentation held by Santosh Kumar at SEMICON South East Asia, in MITEC, Kuala ...
FOWLP: A Paradigm Shift in Advanced IC Packaging Technology?
Discover the presentation held by Santosh Kumar at SEMICON South East Asia, in MITEC, Kuala ...

Access to all our presentations