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Advanced Packaging

Samsung Electronics, the world actor in advanced memory technology, has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems. 

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Big foundries like TSMC, Samsung, GlobalFoundries, UMC and SMIC are entering the emerging NVM memory business. They will introduce MRAM and RRAM technology for embedded MCUs in the 2018/2019 timeframe. Emerging NVM is a good opportunity for foundries to significantly grow their memory business, as it is CMOS compatible technology.

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Camtek, announced that it has signed a definitive agreement with an affiliate of Principle Capital, a Shanghai-based private-equity fund, to sell its PCB business for $35 million, of which $32 million will be paid in cash upon closing and an additional amount of up to $3 million conditioned upon the PCB business’ financial performance. 

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Toshiba America Electronic Components, (TAEC), a committed technology company, announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™ to deliver better transfer speeds and power efficiency1.

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Woodside Capital Partners International LLC, a global, independent investment bank and Yole Développement SA (Yole) announce a joint venture. Yole will serve as a research partner for Woodside Capital’s M&A advisory practice, which provides strategic and financial advice to emerging growth companies in the technology sector.

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Advances Surface Prep and Clean (SP&C) materials position for semiconductor advanced packaging - Versum Materials announced today that it has agreed to acquire Dynaloy, LLC from Eastman Chemical Company for approximately $13 million. Dynaloy is a leading supplier of formulated cleaning solutions for the semiconductor and specialty manufacturing industries.

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Upcoming Events

> IWLPC – International Wafer-Level Packaging Conference
(October 24 - October 26, San Josée, USA)

(November 8 - November 10, Atlanta, GA)

> Electronics Packaging Technology Conference (EPTC)
(December 6 - December 9, Singapore)



Advanced Packaging Industry 2017
Discover the presentation held by Andrej Ivankovik at ASE Forum Tech, on June 28th 2017, in ...
3D and 2.5D Technology: Current Adoption, Market Trends & Future Challenges
Discover the presentation held by Emilie Jolivet at MinaPAD, in Grenoble, France on May 2017.
Where is Advanced IC Packaging Technology Heading: Key Trends & Business Update
Discover the presentation held by Santosh Kumar at SEMICON South East Asia, in MITEC, Kuala ...

Access to all our presentations