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Advanced Packaging

SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, has entered into an agreement to acquire Primoceler Oy, a Finnish pioneer in glass micro-bonding. The company’s innovative hermetic packaging technology creates new possibilities for protection of sensitive electronics in medical implants, MEMS devices, and other reliability-critical applications.

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Yole Developpement has released the second edition of its 3D imaging & sensing report at an extremely interesting time for this technology’s use in smartphones.

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The wide-bandgap material gallium-nitride (GaN) has many advantages over silicon (Si) when it comes to applications in the area of power electronics. With a higher breakdown strength and lower on-resistance, GaN-based power devices can convert power more efficiently than most advanced Si-based devices. Apart from these assets, GaN-based power devices have a 10 – 100 times faster switching speed than Si-based devices, which makes them perform significantly better at the system level. With these properties, the first generation of GaN-based power devices have found applications, such as battery chargers for mobile phones and  electric cars, point-of-load power systems, industrial power supplies, DC/DC convertors for servers, and invertors for solar panel connections to the grid, to name a few.
 
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FOWLP is the fastest-growing packaging platform, adopted for various applications from mobile and automotive to medical and packaging, for both low-end (i.e. audio codecs) and high-end devices (i.e. APU). However, cost is still a concern compared to other mature packaging platforms, and end-customers are always pushing for a lower price. 

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Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP.

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A new era of high-performance RF and power switching products has begun. Corning tand Menlo Micro, the company responsible for re-inventing one of the most fundamental building blocks of electronic systems – the electronic switch – announced a major milestone in the development of Menlo’s revolutionary Digital-Micro-Switch (DMS) technology platform. The two companies have demonstrated the successful integration of Through Glass Via (TGV) packaging technology, enabling the expansion of Menlo’s high-performance RF and power products to ultra-small wafer scale packaging.

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Upcoming Events


> IC & Sensor Packaging Technology EXPO - 2019
(January 16 - January 18, Tokyo, Japan)

Presentation

Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...
High End Performance Application key Driver for Advanced Packaging
Discover the presentation held by Emilie Jolivet, Division Director, Semiconductor & Softwar...
Fan-Out Packaging Wafer and panel technologies and market trends
Discover the presentation held by Jérôme Azemar from Yole Développement, during ICEP in K...

Access to all our presentations