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Advanced Packaging

An article written by Mark LaPedus for Semiconductor Engineering - Progress on 3D-ICs, using HBM with fan-outs, and other new approaches. A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year.

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According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like AI , 5G, and AR/VR are creating huge business opportunities. Therefore, the megatrends are directly contributing to the growth of advanced packaging industry, showing an impressive 7% CAGR to reach US$39 billion in 2023 (1). Today, megatrend applications are fueling the next generation of advanced packaging platforms including high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip…

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Last week the whole microelectronic community was in Munich. Therefore, impressive was the key word to describe the trade show, ELECTRONICA / SEMICON EUROPA this year. With 18 halls, numerous conferences and qualified audience including 73,451 trade visitors and 2,912 exhibitors, the show was the place to be in Europe. The whole microelectronic supply chain attended the show: from materials suppliers to devices markers, including equipment manufacturers, design houses, foundries and more, all players were there to meet their customers and partners. Number of business meetings taking place in Munich last week is probably remarkable and also confidential. 

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In the quest for cost reduction, the semiconductor industry has always been involved in the development of innovative solutions. End customers are always pushing for low cost packaging solutions, along with higher performance.  Panel-level packaging (PLP) shifts packaging from wafer format to strips, and then to large panels.

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An article written by Mark Lapedus, SEMICONDUCTOR ENGINEERING - Although IC packaging industry braces for slower growth in 2019, advanced packaging remains a bright spot. 

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The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments.

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Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations