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Advanced Packaging

In 2016, Yole Développement (Yole) already pointed out the impressive growth of the EV/HEV industry and its huge impact on the power electronics industry with numerous technical issues. Two years later, cards have been handling, the playground is ready and the game should reveal some surprises.

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The unstoppable wave of transport electrification is not just a headline for German newspapers after Dieselgate, it is real – and the wave is originating in China. Chinese car makers have now more than half of the sales for battery and plug-in hybrid electric vehicles (BEV and PHEV), in an exploding market. In 2017, people bought 1.2 million BEVs and PHEVs, a 52% increase compared to 2016. Car makers sold 2.8 million full and mild HEVs last year, a 22% year-to-year increase. The new Yole Développement report "Power electronics for EV/HEV 2018" provides all the details on this market’s evolution and its impact on power devices and power modules. Want to know more?

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Plasma-Therm announced that it has acquired KOBUS, an innovative plasma deposition, which enables F.A.S.T®, a valuable alternative to ALD where thick and conformal films are required.This unique deposition method is at the crossroads of ALD and CVD: F.A.S.T. stands for “Fast Atomic Sequential Technology.” F.A.S.T. is enabled by proprietary CVD reactor design combined with pulsing capability, and while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges.

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The advanced electronic packaging industry has seen major changes in recent years. Fan-out wafer level packaging (FO WLP) has grown, and TSMC has penetrated the high-end market. Through-silicon via (TSV) integration has been adopted into volume production in high-bandwidth memory (HBM), which is key for artificial intelligence (AI) and high-end applications in general. The next expected evolution is to move FO packaging from wafer size to panel format, to benefit from packaging more die in parallel. What’s the status of panel-level packaging (PLP)? How many devices packaged in this way will be produced in the next three years? Which companies are winning this race? Yole Développement’s new “Status of Panel Level Packaging 2018” report provides the answers. Here are the highlights of our latest analysis.

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Why this technology approach is suddenly getting attention, and what hurdles still remain - By Mark Lapedus for SEMICONDUCTOR ENGINEERING.  Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors.

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ASM Pacific Technology (ASMPT) has announced today that it has signed a definitive agreement with Tokyo Electron (TEL) to acquire TEL NEXX (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing their growth strategy of tapping onto new high growth markets and expanding their product offerings to the semiconductor advanced packaging market. Established in 2001, NEXX is the forerunner in Advanced Packaging market and has strong technological capabilities in the highly specialized Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) technologies.

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Upcoming Events

> Advanced Packaging for Flexible Electronics Symposium
(April 26 - April 26, San Jose, USA)

> MINAPAD 2018
(May 16 - May 17, Grenoble, France)

> Medical Electronics Symposium
(May 16 - May 17, Dallas, USA)


How will sensor technologies impact the medical robot of the future?
Discover the presentation held by Marjorie Villien at Medisens2018, on February 27, 2018, in...
2018 a turning point for 3D TSV integration: will AI be the real opportunity for 3D and 2.5D integration?
Discover the presentation held by Emilie Jolivet at IMPAS 2018, on March 2018, in Fountain H...
Fan-Out Packaging: Wafer and panel technologies and market trends
Discover the presentation held by Jérôme Azemar at IMPAS 2018, on March 2018, in Fountain ...

Access to all our presentations