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Advanced Packaging

ICEP is the largest international conference on electronic packaging in Japan,  attracting more than 360 attendees and hosting about 35 technical sessions.  ICEP provides a strong platform to demonstrate your technologies and products  as well as expand your customer network.

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Driven by application diversification, IPDs continue their promising growth, announces Yole Développement (Yole). Miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.

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GE Ventures and FLEXCEED announced that FLEXCEED has been granted a patent license and technology transfer of a next-generation packaging solution based on polyimide film substrates embedded with electronic components for power electronics called Power OverLay (POL)*1. This license and technology transfer deal, signed in February, 2017, is a strategic collaboration between GE and FLEXCEED in both technology and business development. Detailed information about launching POL business will be advised at a later date.

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  • AT&S positions itself for enormous growth potential in the area of autonomous driving. 
  • Technology expansion and capacity increase for high-frequency printed circuit boards at the existing sites in Nanjangud, India and Fehring, Austria. 
  • Start in May 2018 and March 2019, respectively.
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Reed Exhibitions Japan Ltd., Japan’s largest trade show organiser, held 47th NEPCON JAPAN from January 17 to 19 in Tokyo. The show is Asia's largest exhibition for electronics manufacturing R&D and manufacturing technology consisting of 7 fairs.

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Micron 5200 SATA Enterprise SSDs Empower Fast, Consistent Quality of Service for Business-Critical Virtualized Workloads and Cloud Architectures. Micron Technology,launched the Micron® 5200 series of SATA solid state drives (SSDs), maintaining industry-leading performance, consistency, capacity, reliability, and overall infrastructure value. Built on Micron's new industry-leading 64-layer 3D NAND technology, the Micron 5200 series of SSDs offers a cost-optimized SATA platform for business-critical virtualized workloads that cripple on a hard drive, such as OLTP, BI/DSS, VDI, block/object and media streaming.

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Upcoming Events

> ISS Europe
(March 4 - March 6, Dublin, Ireland)

> IMAPS Device Packaging Conference & Global Business Council
(March 6 - March 8, Fountain Hill, USA)

> ICEP-IAAC 2018
(April 17 - April 21, Kuwana, Japan)


From Semiconductor Die to PCB: Changing Landscapes & Future Requirements
Discover the presentation held by Thibault Buisson from Yole Développement, during EIPC 201...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
MEMS Sensor and IC advanced package: How automotive and AI will challenge packaging business
Discover the presentation held by Emilie Jolivet from Yole Développement, during NEPCON in ...

Access to all our presentations