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Advanced Packaging

Boschman Advanced Packaging Technology, formerly known as Boschman Groupunderwent a comprehensive corporate re-branding. The existing entitiesAdvanced Packaging Center and Boschman Technologies have merged into Boschman Package Development, Boschman Assembly Services and Boschman Equipment.

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One of the world’s largest outsourced assembly and test providers names AP300E™ their preferred lithography system due to Veeco’s industry-leading uptime and process performance - Veeco Instruments announced that one of the world’s largest outsourced assembly and test (OSAT) providers has purchased multiple Veeco AP300E lithography systems.

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Two segments key to semiconductor industry growth – advanced materials and flexible hybrid electronics – will take center stage at SEMICON Europa. Focused on the latest trends and new business opportunities, the SEMI Strategic Materials and 2018 FLEX Europe - Be Flexible conferences will highlight demand drivers for new materials in the microelectronics supply chain at SEMICON Europa 2018, co-located with Electronica, in Munich, Germany, November 13-16, 2018. Registration for the two conferences is open. To register for SEMICON Europa, click here.

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AMD announced the AMD Radeon Instinct™ MI60 and MI50 accelerators, the world’s first 7nm datacenter GPUs, designed to deliver the compute performance required for next-generation deep learning, HPC, cloud computing and rendering applications. Researchers, scientists and developers will use AMD Radeon Instinct™ accelerators to solve tough and interesting challenges, including large-scale simulations, climate change, computational biology, disease prevention and more.

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An article written by Mark Lapedus for Semiconductor Engineering - Cost and the lack of a panel-size standard gives fan-out a slower start. After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors.

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“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of innovation for the companies involved. According to Yole’s analyst, Santosh Kumar, the advanced packaging market should reach about US$ 39 billion in 2023…

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Upcoming Events


> Heterogeneous Integration: The Path Forward
(December 5 - December 5, Milpitas, CA)

> 20th Electronics Packaging Technology Conference 2018 (EPTC)
(December 6 - December 9, Singapore)

> IC & Sensor Packaging Technology EXPO - 2019
(January 16 - January 18, Tokyo, Japan)

Presentation

Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...
High End Performance Application key Driver for Advanced Packaging
Discover the presentation held by Emilie Jolivet, Division Director, Semiconductor & Softwar...

Access to all our presentations