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Advanced Packaging

Atotech is one of the global actors of specialty chemicals and equipment manufacturing. With its innovative solutions it is at the forefront of customer needs and market developments. Sustainable solutions, cost-effective products and processes and technological leadership help tackle the industry’s challenges, such as the increasing cost pressures within the PCB HDI industry.

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As development of packaging technologies intensifies, in order to accommodate further front-end scaling trends and multi-die integration, advanced FO RDL and FC substrates represent the key interconnect components. The competition between FO and FC packages and the features of their interconnect components is resulting in an abundance of new package architectures that are crucial in enabling future products and markets.

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Advanced Packaging & System Integration Technology Symposium – April 20&21, 2017 – Wuxi, China | 2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions. “And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on

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Kulicke & Soffa Industries, announced the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

The 180 square meter laboratory adds to the Company's existing base of global application facilities. The Netherlands site uniquely houses a complete prototype assembly line of K&S Advanced Packaging and Electronics Assembly equipment.

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2016 was a turning point for fan-out packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution (1), the market changed. Thus advanced packaging leaders decided large investments for the development of fan-out platforms, impacting the related equipment and materials market.

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Yole Développement expects the fan-out wafer level packaging (FOWLP) equipment market to expand at an impressive compound annual growth rate of 42.5% from 2015-2021, reaching a value of around $694M in 2021. Yole’s “Equipment and Materials for Fan-Out Packaging 2017” report details this market’s evolution and offers a comprehensive overview of the available technologies, equipment and materials challenges, and key process steps for fan-out packaging. Growth will be significant for all equipment and material types, indicating broad benefit from the FOWLP platform’s success. However, the challenges and market landscapes are very different from process step to process step, and the market is quite diversified.

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What is Driving the 3D TSV Technologies Business: Market Update and Technical Trends
Discover the presentation held by Santosh Kumar at IMAPS DPC, in Fountain Hills, Arizona USA...
What's Happening in China Advanced Semiconductor Packaging Landscape
Discover the presentation held by Santosh Kumar at IMAPS DPC, in Fountain Hills, Arizona USA...
Fan-Out PackagingTechnologies and market trends
Discover the presentation held by Jérôme Azemar at IMAPS DPC, in Fountain Hills, Arizona U...

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