Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Advanced Packaging

An article written by Gina Roos for EPS - Contract DRAM prices increased by five percent in the third quarter of 2017, compared to the previous quarter, driving record quarterly revenues for DRAM makers, according to DRAMeXchange, a division of TrendForce. Due to continued tight supply and limited bit supply growth, DRAM revenue increased 16.2 percent sequentially.

Read more ...

State-of-the-art Fan-out Wafer Level Packaging (FOWLP) development line will enable IME’s consortium members spanning across the industry value chain to develop cost-effective advanced packaging solutions, and spur high-volume manufacturing of next-generation Internet of Things (IoT) technologies

Read more ...

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world's leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous European customers, this represents an excellent opportunity to receive an update on the company’s innovation in terms of products and technology.

Read more ...

New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm.

Read more ...

The CCM industry use to be a very fragmented market place. According to Yole Développement (Yole), this market is moving slowly towards the consolidation phase with significant technology changes and supply chain evolution. In 2016, this ecosystem showed 10 companies beyond US$ 1 billion in revenue. Within the CIS market segment for CCM applications, the 3 main players are sharing 75% of the total market… The CCM industry revenue was US$23.4 billion in 2016 and is expecting to reach US$46.8 billion in 2022.

Read more ...

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device ASP , resulting in big memory IDMs reaping record profits. According to Yole Développement (Yole), the “More than Moore” market research and strategy consulting company, the total 2016 memory packaging market is estimated at about US$20 billion with a 4.6% CAGR until 2022. Therefore, memory devices are using diverse packaging from lead-frame based to TSV .

Read more ...

Upcoming Events


> MEPTEC - Semiconductor Packaging Symposium
(November 30 - November 30, Milpitas, CA)

> 3D ASIP - 3D Architectures for Heterogeneous Integration and Packaging
(December 5 - December 7, San Francisco, USA)

> Electronics Packaging Technology Conference (EPTC)
(December 6 - December 9, Singapore)

Webcast

No events