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Advanced Packaging

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of innovation for the companies involved. According to Yole’s analyst, Santosh Kumar, the advanced packaging market should reach about US$ 39 billion in 2023…

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In the era of a slowing of Moore’s Law, advanced packaging has become an enabler for future innovation in semiconductors. The semiconductor industry is entering a disruptive phase where, along with mobile, new mega drivers such as big data, AI, 5G, high-performance computing (HPC), IoT (including industrial IoT), smart automotive, industry 4.0 etc., have the potential to transform the industry putting it on a high growth path.

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In the quest for cost reduction, the semiconductor industry has always been involved in the development of innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large size panels dedicated to IC assembly. Efficiency and economies of scale are clearly the added-value of this path.

Moving fan-out package manufacturing from wafer, FOWLP, to large scale panel, FOPLP, could be the solution for a wider adoption. The FOWLP market is expected to show significant growth of 20% between 2018 and 2023, reaching about US$ 2.3 billion by 2023. FOPLP technology is now a reality after years of development and could become a serious threat, announced Yole Group of Companies, including System Plus Consulting and Yole Développement (Yole). And therefore, according to the Group, many players are moving to high-volume manufacturing in 2018 or 2019.

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Electro Scientific Industries, an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced the availability of its new CapStone flexible printed circuit board (PCB) laser processing system, which offers 2X throughput improvement over its predecessor for processing blind and through hole vias ̶ the highest in the industry.

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Now is the best period the semiconductor industry has ever experienced, and this will certainly continue for the next 18 months. Mobile phones have more complex semiconductor content, cars are the ‘new’ electronic devices, with connectivity, electrification and autonomous driving. Meanwhile, data centers are becoming the knowledge center of the world and new electronic currencies are emerging. All these factors are pushing the semiconductor industry to new heights.

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Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations