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Advanced Packaging

Flex has entered into an agreement with Multi-Fineline Electronix (“MFLEX”), a wholly-owned subsidiary of Suzhou Dongshan Precision Manufacturing (“DSBJ”), to divest the China-based operations of the Flex subsidiary, Multek. According to the terms of the agreement, upon closing, MFLEX will acquire all of the equity interests in the non-US subsidiaries of Flex that operate the China-based business of Multek, for proceeds of approximately $273 million, net of cash. Multek will continue to operate with its current name and location in Zhuhai, China.

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FOWLP is the fastest-growing packaging platform, adopted for various applications from mobile and automotive to medical and packaging, for both low-end (i.e. audio codecs) and high-end devices (i.e. APU). However, cost is still a concern compared to other mature packaging platforms, and end-customers are always pushing for a lower price. 

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Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP.

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SCHOTT AG, an international technology group in the areas of specialty glass and glass-ceramics, has entered into an agreement to acquire Primoceler Oy, a Finnish pioneer in glass micro-bonding. The company’s innovative hermetic packaging technology creates new possibilities for protection of sensitive electronics in medical implants, MEMS devices, and other reliability-critical applications.

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Yole Developpement has released the second edition of its 3D imaging & sensing report at an extremely interesting time for this technology’s use in smartphones.

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The wide-bandgap material gallium-nitride (GaN) has many advantages over silicon (Si) when it comes to applications in the area of power electronics. With a higher breakdown strength and lower on-resistance, GaN-based power devices can convert power more efficiently than most advanced Si-based devices. Apart from these assets, GaN-based power devices have a 10 – 100 times faster switching speed than Si-based devices, which makes them perform significantly better at the system level. With these properties, the first generation of GaN-based power devices have found applications, such as battery chargers for mobile phones and  electric cars, point-of-load power systems, industrial power supplies, DC/DC convertors for servers, and invertors for solar panel connections to the grid, to name a few.
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Upcoming Events

> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)


Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

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