Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Advanced Packaging

Performance-driven applications like PCs and smartphones are giving way to functional applications that are helping mold the semiconductor industry’s future. In this context, advanced semiconductor packaging is seen as a way to increase a semiconductor product’s value by adding functionality, maintaining/increasing performance, and lowering cost – and to this end, the printed circuit board (PCB) is no longer just an interconnection, but also an integration solution. With substrate-like PCBs (SLP) appearing in Apple’s latest iPhones, PCB and substrate manufacturers have started producing SLP and investing in modified semi-additive processes (mSAP). More details are offered in Yole Développement’s recent report, Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate-like PCB Trends.

Read more ...

LiDAR - Light Detection And Ranging - is a super-hot technology, required by advanced driver assistance systems (ADAS) and robotic cars. That’s creating a demand – but there are only a few products now available, from Valeo and Velodyne among very few others, with the right specifications and robustness to be implemented in cars. The requested specifications are a moving target and camera module, radar system and car manufacturers are trying to avoid using today’s complex and immature systems. Below we discuss Yole Développement’s opinion on what will happen, which is based on our new report LiDARs for Automotive and Industrial Applications 2018.

Read more ...

Advanced Semiconductor Engineering said it is investing NT$12.5 billion (US$429 million) on a new advanced fab in Kaohsiung to expand capacity, with the aim of keeping up the pace with high demand for system-in-a-package (SiP) services.The rapid proliferation of the slim Internet of Things devices is driving demand for SiP packaging technology, which encloses several chips, such as microprocessors and memory chips, in a single module, the world’s largest chip tester and packager said.

Read more ...

Unity Semiconductor Will provide applications Engineering and Field Service Support to local customers - UnitySC, famous in advanced inspection and metrology solutions, announced the opening of its Asia subsidiary, Unity Semiconductor (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at Tai-Yuan Hi-Tech Industrial Park, Jubei City, Hsinchu, Taiwan, and has field offices in Singapore, Korea and Shanghai, as well as a presence in Japan.

Read more ...

New building doubles space for final assembly of EVG equipment to support long-term growth targets at corporate headquarters in St. Florian am Inn, Upper Austria.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion  phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.

Read more ...

Grades 1 and 2 qualification supports a wider range of infotainment, GPS and radar applications.STATS ChipPAC Pte, a leading provider of advanced semiconductor packaging and test services, announced the expanded qualification of its embedded Wafer Level Ball Grid Array (eWLB) technology for Grades 1 and 2 of the AEC-Q100 standards established by the Automotive Electronics Council (AEC).

Read more ...

Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations