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Advanced Packaging

The demand for lower cost plus higher performance, coupled with OSAT /assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry to develop innovative solutions. One approach to reducing overall cost is to move to a larger-size panel format. This technology, named Panel Level Packaging (PLP) takes advantage of efficiency and economies of scale. In this favorable context, the market research and strategy consulting company Yole Développement (Yole), announces a US$285 million market in 2023, showing a 51% CAGR during the 2017-2023 period.

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The advanced electronic packaging industry has seen major changes in recent years. Fan-out wafer level packaging (FO WLP) has grown, and TSMC has penetrated the high-end market. Through-silicon via (TSV) integration has been adopted into volume production in high-bandwidth memory (HBM), which is key for artificial intelligence (AI) and high-end applications in general. The next expected evolution is to move FO packaging from wafer size to panel format, to benefit from packaging more die in parallel. What’s the status of panel-level packaging (PLP)? How many devices packaged in this way will be produced in the next three years? Which companies are winning this race? Yole Développement’s new “Status of Panel Level Packaging 2018” report provides the answers. Here are the highlights of our latest analysis.

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Why this technology approach is suddenly getting attention, and what hurdles still remain - By Mark Lapedus for SEMICONDUCTOR ENGINEERING.  Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors.

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In 2016, Yole Développement (Yole) already pointed out the impressive growth of the EV/HEV industry and its huge impact on the power electronics industry with numerous technical issues. Two years later, cards have been handling, the playground is ready and the game should reveal some surprises.

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The unstoppable wave of transport electrification is not just a headline for German newspapers after Dieselgate, it is real – and the wave is originating in China. Chinese car makers have now more than half of the sales for battery and plug-in hybrid electric vehicles (BEV and PHEV), in an exploding market. In 2017, people bought 1.2 million BEVs and PHEVs, a 52% increase compared to 2016. Car makers sold 2.8 million full and mild HEVs last year, a 22% year-to-year increase. The new Yole Développement report "Power electronics for EV/HEV 2018" provides all the details on this market’s evolution and its impact on power devices and power modules. Want to know more?

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Plasma-Therm announced that it has acquired KOBUS, an innovative plasma deposition, which enables F.A.S.T®, a valuable alternative to ALD where thick and conformal films are required.This unique deposition method is at the crossroads of ALD and CVD: F.A.S.T. stands for “Fast Atomic Sequential Technology.” F.A.S.T. is enabled by proprietary CVD reactor design combined with pulsing capability, and while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges.

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Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations