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Advanced Packaging

ASM Pacific Technology (ASMPT) has announced today that it has signed a definitive agreement with Tokyo Electron (TEL) to acquire TEL NEXX (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing their growth strategy of tapping onto new high growth markets and expanding their product offerings to the semiconductor advanced packaging market. Established in 2001, NEXX is the forerunner in Advanced Packaging market and has strong technological capabilities in the highly specialized Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) technologies.

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Combined core competencies deliver comprehensive inspection and metrology offering for full spectrum of semiconductor applications. Advanced inspection and metrology solutions announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications.

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The 34th annual conference and exhibition will bring together leading industry experts in San Jose, CA to share ideas that will shape future technologies.

The SEMI-THERM Educational Foundation (STEF) proudly announces that the 34th Annual Thermal Measurement, Modeling and Management Symposium will take place from Monday, March 19th to Friday, March 23rd, 2018.

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Chip Scale Review and SMTA are pleased to announce plans for the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition held October 23-25, 2018 in San Jose, California. IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of Wafer-Level, 3D, and Advanced Manufacturing and Test.

The IWLPC Technical Committee invites you to submit an abstract for presentations, posters and workshops.

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The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. IoT , the automotive market, 5G connectivity, AR & VR , and AI are part of them. In this context, advanced semiconductor packaging is seen as a way to increase the value of a semiconductor product by adding functionality, maintaining/increasing performance, and lowering cost – and to this end, PCB is not just an interconnection anymore but also an integration solution…

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ICEP is the largest international conference on electronic packaging in Japan,  attracting more than 360 attendees and hosting about 35 technical sessions.  ICEP provides a strong platform to demonstrate your technologies and products  as well as expand your customer network.

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Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations