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Advanced Packaging

Imec and BESI to work on D2D and D2W thermocompression bonding solution.

At the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for Read more ...
EVG®850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices.

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor Read more ...
Laser technology for separating microchips complements the Chemnitz Company’s product portfolio.

Jenoptik and 3D-Micromac AG announce the technology transfer of thermal laser separation (TLS-Dicing®) as part of a so-called asset Read more ...
At the recent IWLPC Conference in San Jose, Klaus Ruhmer of Rudolph Technologies addressed the convergence of Front End (FE), Back End (BE) and flat panel Display technologies that is happening in order to meet the requirements of mid end packaging Read more ...

Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)

Presentation

Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

Access to all our presentations