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Advanced Packaging

“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.

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AMD announced the AMD Radeon Instinct™ MI60 and MI50 accelerators, the world’s first 7nm datacenter GPUs, designed to deliver the compute performance required for next-generation deep learning, HPC, cloud computing and rendering applications. Researchers, scientists and developers will use AMD Radeon Instinct™ accelerators to solve tough and interesting challenges, including large-scale simulations, climate change, computational biology, disease prevention and more.

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An article written by Mark Lapedus for Semiconductor Engineering - Cost and the lack of a panel-size standard gives fan-out a slower start. After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors.

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Boschman Advanced Packaging Technology, formerly known as Boschman Groupunderwent a comprehensive corporate re-branding. The existing entitiesAdvanced Packaging Center and Boschman Technologies have merged into Boschman Package Development, Boschman Assembly Services and Boschman Equipment.

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One of the world’s largest outsourced assembly and test providers names AP300E™ their preferred lithography system due to Veeco’s industry-leading uptime and process performance - Veeco Instruments announced that one of the world’s largest outsourced assembly and test (OSAT) providers has purchased multiple Veeco AP300E lithography systems.

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Two segments key to semiconductor industry growth – advanced materials and flexible hybrid electronics – will take center stage at SEMICON Europa. Focused on the latest trends and new business opportunities, the SEMI Strategic Materials and 2018 FLEX Europe - Be Flexible conferences will highlight demand drivers for new materials in the microelectronics supply chain at SEMICON Europa 2018, co-located with Electronica, in Munich, Germany, November 13-16, 2018. Registration for the two conferences is open. To register for SEMICON Europa, click here.

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Upcoming Events

> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)


Markets Advanced Substratesa nd Embedded Die package
Discover the presentation held by Emilie Jolivet, Semiconductor and Software Division Direct...
Material Trends in Advanced Packaging
Discover the presentation held by Santosh Kumar from Yole Développement, during Semicon Kor...
Advanced Substrates and Embedded Die package
Discover the presentation held by Emilie Jolivet, Director of the Semiconductor & Software D...

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