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Advanced Packaging

More than half of MEMS packaging today is done by OSATs and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for RF applications, is making the MEMS business more and more attractive for OSATs, which have started to offer wider range of packaging solutions and tests, accordingly to automotive standards.

Yole’s analysts pursue their analysis of the advanced packaging industry applied to MEMS devices. Facing a dynamic market, the company details the technical and business trends and offers its vision of the industry. In terms of packaging and testing, are MEMS devices the next opportunity for OSAT companies?... Full article

Source: www.yole.fr

Author:

This article has been written by Emilie Jolivet, Technology & Market Analyst, Yole Développement, in the Advanced Packaging and Semiconductor Manufacturing team.
She holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA Toulouse. After an internship in failure analysis at Freescale, she took the position of R&D engineer for seven years in photovoltaic business and co-authored several scientific articles. Enriched by this experience, she graduated with an MBA from IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016.

 

 

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From Semiconductor Die to PCB: Changing Landscapes & Future Requirements
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Material Trends in Advanced Packaging
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MEMS Sensor and IC advanced package: How automotive and AI will challenge packaging business
Discover the presentation held by Emilie Jolivet from Yole Développement, during NEPCON in ...

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