Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Advanced Packaging

Semiconductor foundry to leverage revolutionary wafer bonding And 3D interconnect technology for Advanced Image Sensor solutions.
Semiconductor Manufacturing International Corporation (SMIC), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi.

“As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities,” said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. “This technology is a key enabler for the fabrication of 3D stacked image sensors, and by working closely with Invensas, we will accelerate the development and commercialization of a new generation of imaging products for our customers.”

DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for thru silicon vias (TSVs) reducing die size and cost while providing a roadmap to pixel level interconnect for future generations of image sensors.

“We are thrilled to enter into this licensing agreement with SMIC, one of the largest and most respected semiconductor foundries in the world,” said Craig Mitchell, president of Invensas. “SMIC recognizes the significant benefits of DBI technology for customers worldwide. We look forward to working closely with SMIC to integrate this enabling platform into their world-class design and manufacturing environment.”

Source: http://www.invensas.com/

Upcoming Events


> Advanced Packaging for Flexible Electronics Symposium
(April 26 - April 26, San Jose, USA)

> MINAPAD 2018
(May 16 - May 17, Grenoble, France)

> Medical Electronics Symposium
(May 16 - May 17, Dallas, USA)

Presentation

How will sensor technologies impact the medical robot of the future?
Discover the presentation held by Marjorie Villien at Medisens2018, on February 27, 2018, in...
2018 a turning point for 3D TSV integration: will AI be the real opportunity for 3D and 2.5D integration?
Discover the presentation held by Emilie Jolivet at IMPAS 2018, on March 2018, in Fountain H...
Fan-Out Packaging: Wafer and panel technologies and market trends
Discover the presentation held by Jérôme Azemar at IMPAS 2018, on March 2018, in Fountain ...

Access to all our presentations