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Manufacturing

Samsung Electronics, a pioneer in advanced semiconductor technology, announced that its production ramp-up of the 10-nanometer (nm) FinFET process technology is on track with steady high yield to meet customer needs on schedule.

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NST Series provides non-contact full field profilometry to 0.1nm resolution; Delivers unique overlay solution for hybrid bonding. UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai.

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SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor industry and related markets, launched a brand-new automated permanent wafer bonding system. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes up to 200 mm.

Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks.

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Through-silicon via (TSV) market growth was initially driven by backside illumination (BSI) CMOS image sensors (CIS), but this is now under threat. However, in the next few years growth will ride a fresh wave of TSV interconnect adoptions in new areas like fingerprint and ambient light sensors as well as 3D stacked memory applications, according to recent Yole Développement's report, Equipment and Materials for 3D TSV Applications 2017.

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Intel and Mobileye announced a definitive agreement under which Intel would acquire Mobileye, a global actor in the development of computer vision and machine learning, data analysis, localization and mapping for advanced driver assistance systems and autonomous driving. Pursuant to the agreement, a subsidiary of Intel will commence a tender offer to acquire all of the issued and outstanding ordinary shares of Mobileye for $63.54 per share in cash, representing an equity value of approximately $15.3 billion and an enterprise value of $14.7 billion.

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Soitec, a world actor in designing and manufacturing semiconductor materials for the electronics industry, has announced that the ramp up to high-volume production of 200-mm silicon-on-insulator (SOI) wafers ─ manufactured with Soitec’s Smart Cut technology – has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology (Simgui) fully qualified by key Soitec customers.

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