Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Manufacturing

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like AI , 5G, and AR/VR are creating huge business opportunities. Therefore, the megatrends are directly contributing to the growth of advanced packaging industry, showing an impressive 7% CAGR to reach US$39 billion in 2023 (1). Today, megatrend applications are fueling the next generation of advanced packaging platforms including high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip…

Read more ...

Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to build a new 8-inch wafer fab at its manufacturing site in Tainan, southern Taiwan to satisfy robust customer demand.

Read more ...

New system combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package. Electro Scientific Industries, an innovator in laser-based manufacturing solutions for the micro-machining industry, announced the availability of its Geode™ laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB).

Read more ...

Backlog for recently released system increases to over $12M. Rudolph Technologies announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional large wafer manufacturers based in Asia. These orders are in addition to the $3M previously announced and will ship throughout calendar year 2019.

Read more ...

Driven by movements toward further miniaturization and increased functionalities, megatrend applications such as artificial intelligence (AI), 5G, and augmented reality (AR)/virtual reality (VR) are creating huge business opportunities and contributing to the growth of More than Moore (MtM) devices.

Read more ...

New BONDSCALE™ system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap. EV (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the all new BONDSCALE™ automated production fusion bonding system.

Read more ...

Upcoming Events

No events

Presentation

Wafer Starts for More than Moore - Market Trends
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst in Semico...
Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...
How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...

Access to all our presentations