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- Complementary portfolios and scale enable world-class end-to-end solutions
- Diversifies revenue base and end markets; increases SAM to $16 billion+
- Combined R&D innovation engine and IP portfolio accelerates product leadership
- Creates best-in-class financial model

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Laser applications in the semiconductor industry are broad since various laser technologies have started integrating into major semiconductor processes including laser cutting, drilling, welding/bonding, marking, patterning, measurement, deposition.
The laser equipment market will grow at a 15% compound annual growth rate from 2016-2022 (CAGR 2016-2022) to reach more than 4B$ by 2022 mainly driven by dicing, via drilling as well as patterning process steps fueled by PCB flex, IC substrates and semiconductor devices processing applications, according to Yole Développement report “Laser Technologies for Semiconductor Manufacturing”.
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Oxford Instruments Plasma Technology is pleased to announce that Lasertel of Arizona, US have recently purchased one of their advanced inductively coupled plasma chemical vapour deposition (ICPCVD) systems for the manufacture of Solid State Lasers (SSL).

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New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm.

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Plan Optik AG, the leading manufacturer of glass and quartz wafers, now offers extremely thin wafers from glass and quartz.

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The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device ASP , resulting in big memory IDMs reaping record profits. According to Yole Développement (Yole), the “More than Moore” market research and strategy consulting company, the total 2016 memory packaging market is estimated at about US$20 billion with a 4.6% CAGR until 2022. Therefore, memory devices are using diverse packaging from lead-frame based to TSV .

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Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli at Semicon Europe, in Munich, Germany ...
More than Moore Market trends
Discover the presentation held by Yole Développement at Semicon Europe, in Munich, Germany ...
STTMRAM is moving to large scale commercialization… at last!
Discover the presentation held by Yann De Charentenay at Intermag, in Dublin, Ireland in Apr...

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