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Big foundries like TSMC, Samsung, GlobalFoundries, UMC and SMIC are entering the emerging NVM memory business. They will introduce MRAM and RRAM technology for embedded MCUs in the 2018/2019 timeframe. Emerging NVM is a good opportunity for foundries to significantly grow their memory business, as it is CMOS compatible technology.

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Rudolph Technologies, a provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that it has reached a comprehensive patent settlement with Camtek. in the ongoing patent infringement lawsuits between the two companies. 

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North Carolina State University receives milestone shipment reinforcing industry reliance on Veeco CNT for ALD technology research and development. Veeco Instruments announced that Veeco CNT, formerly known as Ultratech/Cambridge Nanotech, shipped its 500th Atomic Layer Deposition (ALD) system to North Carolina State University.

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Woodside Capital Partners International LLC, a global, independent investment bank and Yole Développement SA (Yole) announce a joint venture. Yole will serve as a research partner for Woodside Capital’s M&A advisory practice, which provides strategic and financial advice to emerging growth companies in the technology sector.

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Camtek, announced that it has signed a definitive agreement with an affiliate of Principle Capital, a Shanghai-based private-equity fund, to sell its PCB business for $35 million, of which $32 million will be paid in cash upon closing and an additional amount of up to $3 million conditioned upon the PCB business’ financial performance. 

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It’s an obvious thing to say, but the semiconductor industry is all about semiconductor materials. However, due to its excellent chemical, mechanical, electrical, and optical properties, glass applications are constantly evolving. Glass is therefore playing an increasingly important role in the semiconductor market, adopting various functions in integrated circuit (IC) semiconductor devices.

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Upcoming Events

> SEMICON Taiwan 2017
(September 13 - September 15, Taipei, Taiwan)

> Embedded-NVM
(September 25 - September 27, Gardanne, France)

> SEMICON Europa
(November 14 - November 17, Munich, Germany)


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