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Manufacturing

At KPCA Show 2018, held in Gyeonggi-do, Atotech will showcase its latest production solutions for flex/flex-rigid and other PCB types at booth #J201. Next to its product promotion at the trade show booth, the Atotech takes part in the technical conference (hall 7, Kintex 2) with the presentation of two papers.Frank Bruening, Global Business Manager for desmear and metallization at Atotech Deutschland GmbH, will present Printoganth® RA, Atotech’s novel electroless copper process for high-end flex and flex-rigid PCBs on super flexible RA copper foil.

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Veeco Instruments today announced that ON Semiconductor has ordered its Propel® High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system. Based on its successful beta evaluation of the Propel HVM tool, ON Semiconductor ordered the production-level Propel system for GaN power electronics manufacturing. As the industry’s first single-wafer cluster platform, the Propel GaN MOCVD system is specifically designed for high-voltage power-management devices used in data centers; automotive, information and communication technology; defense; aerospace and power distribution systems, among other applications.

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ASM Pacific Technology (ASMPT) has announced today that it has signed a definitive agreement with Tokyo Electron (TEL) to acquire TEL NEXX (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing their growth strategy of tapping onto new high growth markets and expanding their product offerings to the semiconductor advanced packaging market. Established in 2001, NEXX is the forerunner in Advanced Packaging market and has strong technological capabilities in the highly specialized Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) technologies.

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The advanced electronic packaging industry has seen major changes in recent years. Fan-out wafer level packaging (FO WLP) has grown, and TSMC has penetrated the high-end market. Through-silicon via (TSV) integration has been adopted into volume production in high-bandwidth memory (HBM), which is key for artificial intelligence (AI) and high-end applications in general. The next expected evolution is to move FO packaging from wafer size to panel format, to benefit from packaging more die in parallel. What’s the status of panel-level packaging (PLP)? How many devices packaged in this way will be produced in the next three years? Which companies are winning this race? Yole Développement’s new “Status of Panel Level Packaging 2018” report provides the answers. Here are the highlights of our latest analysis.

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Plasma-Therm announced that it has acquired KOBUS, an innovative plasma deposition forerunner, which enables F.A.S.T®, a valuable alternative to ALD where thick and conformal films are required. This unique deposition method is at the crossroads of ALD and CVD: F.A.S.T. stands for “Fast Atomic Sequential Technology.” F.A.S.T. is enabled by proprietary CVD reactor design combined with pulsing capability, and while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges.

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MtM wafer demand reached almost 45 million 8-inch eq wafers in 2017. The wafer demand is expected to reach more than 66 million 8-inch eq. wafers by 2023, with an almost 10% CAGR between 2017 and 2023. According to Yole Développement (Yole)’s definition, the MtM applications include MEMS & sensors, CIS , and power, along with RF devices.

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Upcoming Events


> European Mask and Lithography Conference EMLC 2018
(June 19 - June 20, Grenoble, France)

> IWLPC - International Wafer-Level Packaging Conference 2018
(October 23 - October 25, San Jose, California, USA)

Presentation

Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli at Semicon Europe, in Munich, Germany ...
More than Moore Market trends
Discover the presentation held by Yole Développement at Semicon Europe, in Munich, Germany ...
STTMRAM is moving to large scale commercialization… at last!
Discover the presentation held by Yann De Charentenay at Intermag, in Dublin, Ireland in Apr...

Access to all our presentations