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“The introduction of products by big players, the emergence of new SCM applications and the entry of the top 5 logic foundries will drive the market,” announces Santosh Kumar, Senior Technology & Market Analyst at Yole Développement (Yole).

The “More than Moore” market research & strategy consulting company, Yole releases this week the Emerging Non-Volatile Memory report, 2017 edition. Under this update, the company presents an overview of the semiconductor memory market and a deep understanding of the emerging NVM applications. Forecasts of each market segment and detailed analysis of each NVM technologies are detailed in this report.

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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications.

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Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Market Analyst at Yole.

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“We have entered a time when MEMS and semiconductor-based sensors, combined with increasing processing power, will bring exciting new applications such as AR/VR , autonomous vehicles, 3D sensing, and 5G communications,” explains Dr Eric Mounier, Sr Technology & Market Analyst at Yole Développement (Yole).

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Robert Bosch will spend roughly one billion euro (about $1.1 billion) to build a 300-mm wafer fab in Dresden, Germany, the company said, confirming German media reports that have been circulating for more than a week.

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The Netherlands Organization for Applied Scientific Research (“TNO”) and USHIO announced that TNO opened an experimental EUV exposure and analysis facility (“EBL2”) used mainly for research & evaluation of EUV optics, masks, pellicles, and sensors on March 27, 2017.

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(June 26 - June 27, Grenoble, France)

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(September 13 - September 15, Taipei, Taiwan)

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