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Manufacturing

Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies. Xperi Corporation is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas ZiBond® and Invensas DBI® 3D semiconductor technologies.

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Toshiba Memory, actor in memory solutions held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

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ASM Pacific Technology (“ASMPT”) announced its strategic investment in Critical Manufacturing (“Critical Manufacturing”), a leading software developer and publisher of state-of-the art manufacturing execution systems (MES). Critical Manufacturing has significant expertise in the integration and networking of machines and systems, as well as IT systems and cloud solutions. This strategic investment would accelerate ASMPT’s efforts to build a portfolio of Industry 4.0 solutions and will boost ASMPT’s software competence in enabling smart factories.

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Toshiba Memory, actor in memory solutions held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

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Oxide-based resistive Ram memory platform development for backend memories. To Offer Non-Volatility Associated with Embedded Designs. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry’s first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

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Article written by Adele Hars for Nanochip, powered by Applied Materials - The semiconductor industry has new drivers in automotive, Internet of Things (IoT), both high- and low power, sensors, and medical and industrial applications—which happen to be traditional European core strengths. The new CEO of French RTO Leti and other industry leaders and analysts see this as a golden opportunity.

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Upcoming Events


> IWLPC - International Wafer-Level Packaging Conference 2018
(October 23 - October 25, San Jose, California, USA)

Presentation

How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...
European Competitiveness in Semiconductor More than Moore Applications: What could happen now?
Discover the presentation held by Jean-Christophe Eloy, President & CEO of Yole Développeme...
Lithography Technologies for More than Moore
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...

Access to all our presentations