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Navitas Semiconductor, the industry’s first and only GaN power IC supplier, has announced major manufacturing partnerships with TSMC and Amkor to support significant customer demand for 2018 & beyond. Since the introduction of the company’s GaN power IC platform last year, the market response has been extraordinary as customers move quickly to adopt the technology.

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The emerging 5G wireless communication standard will bring wholesale change, from services to device technologies shaping new wireless infrastructure, and in the associated supply chain. Yole Développement (Yole) now highlights the technology and market trends 5G is driving in one new report: “5G’s impact on the RF front-end industry: How will wireless infrastructure and cell phone terminals change in the next decade?”. Yole also explores how the system-in-package (SiP) platform will enable such changes in an accompanying report, “Advanced RF System-in-Package for Cell Phones”.

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A wide variety of laser technologies is today available to semiconductor manufacturers and enable the development of innovative semiconductor manufacturing processes. According to Yole Développement (Yole), the laser equipment market will grow at a 15% CAGR between 2016 and 2022 and should reach more than US$4 billion by 2022 (excluding marking). Those figures are showing the massive adoption of laser technologies for semiconductor manufacturing processes.

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The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications and services. One of the key drivers for developing such speed is high resolution video demand (4K, 8K etc.) over mobile devices.

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Oxford Instruments has enabled superior plasma process solutions for its customers in Asia by recently installing state of the art plasma etch equipment in their applications laboratory at the Industrial Technology Research Institute (ITRI) in Taiwan. This further enhances the existing etch and deposition capabilities already provided by Oxford Instruments at the Institute.

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Integra Technologies, a world actor in integrated circuit test and related services, announced that it has acquired CORWIL Technology. CORWIL provides high quality and responsive semiconductor die prep, assembly and test services focusing on Hi-Rel, fast-turn, and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

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