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Manufacturing

“The introduction of products by big players, the emergence of new SCM applications and the entry of the top 5 logic foundries will drive the market,” announces Santosh Kumar, Senior Technology & Market Analyst at Yole Développement (Yole).

The “More than Moore” market research & strategy consulting company, Yole releases this week the Emerging Non-Volatile Memory report, 2017 edition. Under this update, the company presents an overview of the semiconductor memory market and a deep understanding of the emerging NVM applications. Forecasts of each market segment and detailed analysis of each NVM technologies are detailed in this report.

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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications.

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Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Market Analyst at Yole.

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“We have entered a time when MEMS and semiconductor-based sensors, combined with increasing processing power, will bring exciting new applications such as AR/VR , autonomous vehicles, 3D sensing, and 5G communications,” explains Dr Eric Mounier, Sr Technology & Market Analyst at Yole Développement (Yole).

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Robert Bosch will spend roughly one billion euro (about $1.1 billion) to build a 300-mm wafer fab in Dresden, Germany, the company said, confirming German media reports that have been circulating for more than a week.

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The Netherlands Organization for Applied Scientific Research (“TNO”) and USHIO announced that TNO opened an experimental EUV exposure and analysis facility (“EBL2”) used mainly for research & evaluation of EUV optics, masks, pellicles, and sensors on March 27, 2017.

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(September 13 - September 15, Taipei, Taiwan)

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STTMRAM is moving to large scale commercialization… at last!
Discover the presentation held by Yann De Charentenay at Intermag, in Dublin, Ireland in Apr...
Overview of Dicing Technologies and Market Forecast
Discover the presentation held by Amandine Pizzagalli in SPTS / Orbotech Webinar, the 14th o...
Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics

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