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Manufacturing

With the apparition of 4G and complexification leading to increasing demand for filters, RF is restructuring the MEMS industry. A new MEMS player has entered the Top 3: with US$910 million in 2016, the US-based company Broadcom, acquired by Avago Technologies in May 2015, has shifted from #4 in 2015 to #2 in 2016 with its MEMS filter activities.
Yole Développement, part of the Yole Group, today released its annual MEMS manufacturer ranking. This analysis is based on 2016 revenues and is part of Yole’s MEMS & Sensors annual report, Status of the MEMS Industry.

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The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices. Rudolph Technologies announced that two of the industry’s suppliers of advanced packaging services have purchased multiple Firefly Inspection Systems. The Firefly System, with Rudolph’s patented Clearfind™ Technology, can detect defects that are almost impossible to find using conventional imaging techniques – helping to significantly reduce yield-robbing failures in both the front- and back-end of the semiconductor manufacturing process.

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Kulicke & Soffa Industries, announced the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

The 180 square meter laboratory adds to the Company's existing base of global application facilities. The Netherlands site uniquely houses a complete prototype assembly line of K&S Advanced Packaging and Electronics Assembly equipment.

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Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors. EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date.

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Atotech is one of the global actors of specialty chemicals and equipment manufacturing. With its innovative solutions it is at the forefront of customer needs and market developments. Sustainable solutions, cost-effective products and processes and technological leadership help tackle the industry’s challenges, such as the increasing cost pressures within the PCB HDI industry.

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SK Hynix introduced the industry’s first 72-Layer 256Gb(Gigabit) 3D(Three-Dimensional) NAND Flash based on its TLC(Triple-Level Cell) arrays and own technologies. The Company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB(Gigabytes) storage. SK Hynix launched 36-Layer 128Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. In just 5 months, the Company has developed the 72-Layer 256Gb 3D NAND chips, securing the industry’s finest product portfolio.

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