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Manufacturing

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments.

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“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.

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EpiGaN, a European supplier of Gallium Nitride (GaN) technology solutions for telecom, power electronics, and sensor applications, has chosen an Aixtron G5+C tool to meet growing demand from their global customer base. EpiGaN, headquartered in Hasselt/Belgium, is a global supplier of GaN-on-Si and GaN-onSiC material product solutions for next-generation semiconductor devices. The company has selected Aixtron’s G5+C MOCVD system to boost its manufacturing capability of large-diameter GaN-on-Si and GaN-on-SiC epiwafers.

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Taiwanese chipmaker hopes to wean itself off Apple and smartphones. Taiwan Semiconductor Manufacturing TSMC is poised to secure a crucial order from IBM for premium server chips, validating the company as a serious challenger to global chipmaker Intel in the high-value data center market.

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Delivers the highest via drilling throughput in the industry - CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent - Electro Scientific Industries, an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced the availability of its new CapStone™ flexible printed circuit board (PCB) laser processing system, which offers 2X throughput improvement over its predecessor for processing blind and through hole vias ̶ the highest in the industry.

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EVG® ComBond® enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy. EV (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that IHP - Innovations for High Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ComBond® automated high-vacuum wafer bonding system for use in developing next-generation wireless and broadband communication devices.

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Wafer Starts for More than Moore - Market Trends
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst in Semico...
Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...
How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...

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