Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Manufacturing

New 8” wafer fab capability signals the coming of a new generation of Electronics. Marks a major milestone in the design and development of electronic systems. This week at Electronica, Menlo Micro (Menlo), the company responsible for re-inventing the electronic switch, announced that its Digital-Micro-Switch (DMS) technology platform has been successfully ported from an R&D facility to a commercial 8” wafer manufacturing line.

Read more ...

Megatrend markets are pushing More than Moore (MtM) devices to new levels of complexity, resulting in big investments. In fact, the total equipment market for permanent bonding, lithography, and temporary bonding & debonding processes generated revenue of more than >$450M in 2017. This number is expected to reach >$850M by 2023, with a 10% compound annual growth rate (CAGR) over this period.

Read more ...

Sensera, a  provider of MEMS devices and Internet of Things (IoT) solution provider that delivers sensor-based products transforming real-time data into meaningful information, action and value, is pleased to announce it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.
"We are very pleased to be able to expand our production capabilities, closely aligning ourselves with growing customer demand. This new production equipment substantially broadens our existing tool set and enables greater vertical integration and process control," said Tim Stucchi, GM/COO of the Sensera MicroDevices Division.

Read more ...

MRSI Systems part of Mycronic Group announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement.

Read more ...

New system combines high sensitivity, repeatability and throughput to deliver the industry’s best performance and cost-of-ownership for inspection of critical wafer zones.

Read more ...

Driven by the development of data communications and the boom of Internet’s popularity, the sweet spot of Vertical Cavity Surface Emitting Lasers (VCSELs) has evolved. It has been, until recently, in short-distance data communication, but in the last few years, with the development of the latest generation of smartphones, VCSELs have made their way into high volume consumer applications. Automotive applications, such as Light Detection and Ranging (LiDAR) and gesture recognition, are expected to follow.

Read more ...

Upcoming Events

No events

Presentation

Wafer Starts for More than Moore - Market Trends
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst in Semico...
Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...
How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...

Access to all our presentations