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Manufacturing

Toshiba Memory, actor in memory solutions held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

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Oxide-based resistive Ram memory platform development for backend memories to offer non-volatility associated with embedded designs. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, announced the integrated-circuit industry’s first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

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Article written by Adele Hars for Nanochip, powered by Applied Materials - The semiconductor industry has new drivers in automotive, Internet of Things (IoT), both high- and low power, sensors, and medical and industrial applications—which happen to be traditional European core strengths. The new CEO of French RTO Leti and other industry leaders and analysts see this as a golden opportunity.

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Toshiba Memory, actor in memory solutions held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

Read more ...

ASM Pacific Technology (“ASMPT”) announced its strategic investment in Critical Manufacturing (“Critical Manufacturing”), a leading software developer and publisher of state-of-the art manufacturing execution systems (MES). Critical Manufacturing has significant expertise in the integration and networking of machines and systems, as well as IT systems and cloud solutions. This strategic investment would accelerate ASMPT’s efforts to build a portfolio of Industry 4.0 solutions and will boost ASMPT’s software competence in enabling smart factories.

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Micron and Intel announced an update to their 3D XPoint™ joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

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