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Manufacturing

An article written by Amandine Pizzagalli and Emilie Jolivet, Yole Développement for SEMI Newsletter - Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Advanced nodes no longer bring the desired cost benefit, and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to satisfy market demands, the industry is looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.

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SCHOTT AG, an international technology group in the areas of specialty glass and glass-ceramics, has entered into an agreement to acquire Primoceler Oy, a Finnish pioneer in glass micro-bonding. The company’s innovative hermetic packaging technology creates new possibilities for protection of sensitive electronics in medical implants, MEMS devices, and other reliability-critical applications.

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KLA-Tencor announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes. The VoyagerTM 1015 system offers new capability to inspect patterned wafers, including inspection in the lithography cell immediately after development of the photoresist, when the wafer can be reworked.

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SIPLACE TX placement modules are known for setting industry records in performance, accuracy and space efficiency. Now technology actore ASM is pushing the envelope to the limit by presenting a new version of its premium platform that features major improvements. Equipped with the new SpeedStar head, the new model's placement performance has been increased by another 23 percent to up to 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 x 8.2 mm. Other advantages of the new model include reduced power consumption and the planned long-board option for boards with lengths of up to 510 mm.

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Though VCSEL (vertical cavity surface-emitting lasers) have existed for 20+ years, they were relatively unknown until Apple used three of them in the iPhoneX to enable its 3D sensing and facial recognition functions (it is worth noting that in 2016 and 2017, Lenovo and Asus both implemented similar functionalities in their phones).

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Industry-inclusive hub promotes early collaboration and learning from substrate to system level. Leti, a research institute of CEA Tech, and Soitec, a world actor in designing and manufacturing innovative semiconductor materials, announced a new collaboration and five-year partnership agreement to drive the R&D of advanced engineered substrates, including SOI and beyond.
 
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Wafer Starts for More than Moore - Market Trends
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Laser Technologies for Semiconductor Manufacturing Processes
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