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Manufacturing

Orders from customers in Europe and U.S. underscore continued strong demand for 200mm equipment that integrates new control and compliance capabilities. Entrepix a leading provider of wafer cleaning and chemical mechanical planarization (CMP) equipment and process services, announced it has received orders from customers in the U.S. and Europe for its new, improved Entrepix DSS-200 Synergy Double-Sided Cleaners.
 
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Growing demand for advanced packaging in the memory market highlights value of Veeco’s. High volume manufacturing Lithography Systems. Veeco Instruments announced that one of the memory chip manufacturers has ordered multiple AP300™ lithography systems to support the fast growing demand for DRAM with copper (Cu) pillars. The company selected the Veeco tools for their versatility in addressing advanced packaging applications, proven reliability in supporting high volume manufacturing and low total cost of ownership.
 
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FOWLP is the fastest-growing packaging platform, adopted for various applications from mobile and automotive to medical and packaging, for both low-end (i.e. audio codecs) and high-end devices (i.e. APU). However, cost is still a concern compared to other mature packaging platforms, and end-customers are always pushing for a lower price. 

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New system integrates core Pulsar and EmerALD capabilities with higher productivity, enabled by multi-chamber 300mm XP8 platform. ASM International N.V. (Euronext Amsterdam: ASM) announced the Synergis® atomic layer deposition (ALD) tool for advanced-node logic and memory high-volume production applications.

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2001 is the year the first SiC Shottky diode was commercialized. Much has changed since then, especially in the power electronics industry! SiC diodes and transistors have gradually convinced the market that they can replace silicon-based devices, even if they are more expensive and even if their integration means design changes.
Today, SiC MOSFETs have been commercially available for several years and are widely used in multiple applications. Yole Développement (Yole) expects a 29% CAGR over the next five years - in other words, a market that will quadruple in growth! This new report from Yole, Power SiC 2018: Materials, Devices and Applications, details what to expect in the next five years, and why such enormous growth is happening now.
 
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Optics and Imaging Strengthens Capabilities with Precision Coating Technology and Additional Investments. Edmund Optics, the world’s supplier of optical components, has ordered the  SPECTOR® Ion Beam Sputtering System from Veeco Instruments. The new capability is in support of Edmund Optics’ expanding portfolio of high quality laser optics for infrared, visible, and ultraviolet systems.

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Wafer Starts for More than Moore - Market Trends
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst in Semico...
Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...
How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...

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