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Manufacturing

Driven by movements toward further miniaturization and increased functionalities, megatrend applications such as artificial intelligence (AI), 5G, and augmented reality (AR)/virtual reality (VR) are creating huge business opportunities and contributing to the growth of More than Moore (MtM) devices.

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New BONDSCALE™ system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap. EV (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the all new BONDSCALE™ automated production fusion bonding system.

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Several technology suppliers, technology users and research institutes have already confirmed their presentation titles for the Advanced Functional and Industrial Printing conference which returns on the 27-28th March 2019 to Radisson Blu Scandinavia in Düsseldorf. The event offers a particularly broad approach to printing methods which serve the production processes of today and near future. Until end of 2018 delegates can register at early bird rates.

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New system combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package. Electro Scientific Industries, an innovator in laser-based manufacturing solutions for the micro-machining industry, announced the availability of its Geode™ laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB).

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Leti, a research institute at CEA Tech, announced during IEDM an extension of its 300mm silicon-based wafer line to open new R&D avenues for its industrial partners. This extension will allow new innovative technological modules to be inserted in, or made compatible with, industrial flows up to completely pioneered technology routes that enable edge AI, HPC, in memory computing, photonics, power electronics and other high-end applications.

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Last week the whole microelectronic community was in Munich. Therefore, impressive was the key word to describe the trade show, ELECTRONICA / SEMICON EUROPA this year. With 18 halls, numerous conferences and qualified audience including 73,451 trade visitors and 2,912 exhibitors, the show was the place to be in Europe. The whole microelectronic supply chain attended the show: from materials suppliers to devices markers, including equipment manufacturers, design houses, foundries and more, all players were there to meet their customers and partners. Number of business meetings taking place in Munich last week is probably remarkable and also confidential. 

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Presentation

Wafer Starts for More than Moore - Market Trends
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst in Semico...
Laser Technologies for Semiconductor Manufacturing Processes
Discover the presentation held by Amandine Pizzagalli, Technology & Market Analyst, Equipmen...
How megatrends will impact MEMS & Sensors
Discover the presentation held by Eric Mounier, Principal Analyst, Technology & Market, MEMS...

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