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Manufacturing

Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China | Source: Status of the Advanced Packaging Industry report, Yole Développement, 2018 - The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the key words. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are step by step changing our world. Big data, AI , 5G, HPC , IoT , smart automotive, industry 4.0, datacenters and more…, all mega-trends becoming part of our day to day life, with a direct impact on the semiconductor industry and its supply chain. But not only…

In its latest report, Status of the Advanced Packaging Industry, Yole predicts an impressive US$39 billion advanced packaging market in 2023 with 7% CAGR… 

“The advanced packaging is also driven by the wind of changes, due to the impressive impact of the megatrends,” explains Emilie Jolivet, Division Director, Semiconductor & Software at Yole. “Yole and NCAP China have decided to combine their expertise this year again to propose the Advanced Packaging & System Integration Technology Symposium in Shanghai, prior NEPCON China. This Shanghai edition will be the place to be to understand the industry evolution and measure the impact of the megatrends”.

and Yole build an innovative program fully dedicated to the advanced packaging industry: the Advanced Packaging & System Integration Technology Symposium takes place in Shanghai, China, from April 22 to 23, 2019, prior to NEPCON China 2019... Full story

Sources: www.yole.fr - www.ncap.com 

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