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Manufacturing

Through-silicon via (TSV) market growth was initially driven by backside illumination (BSI) CMOS image sensors (CIS), but this is now under threat. However, in the next few years growth will ride a fresh wave of TSV interconnect adoptions in new areas like fingerprint and ambient light sensors as well as 3D stacked memory applications, according to recent Yole Développement's report, Equipment and Materials for 3D TSV Applications 2017.

3D stacked BSI has powered the TSV market for a couple of years and still supports TSV integration growth today. However, we expect the importance of 3D stacked BSI in the TSV market to decrease by 2019 due to the entrance of 3D hybrid technology, which does not require TSV interconnects. Sony, the CIS leader, started the 3D hybrid method, which was adopted for the first time in the Samsung Galaxy S7 camera rear module. This challenge to TSVs in BSI CIS could be worsened by the 3D single-photon avalanche diodes (SPAD) developed by ST Microelectronics, which will also benefit from hybrid technology. Strong players like SMIC or XMC are actively working on the hybrid approach for the next generation of BSI CIS. Another scenario could happen in the next few years and impact the TSV market in a different way. That scenario would see some CIS manufacturers focusing on developing multi-stack structures combining both 3D stacked BSI as well as 3D hybrid stacked architecture.

Wafer forecast for TSV application by segments Yole report

 

(Source: Equipment and Materials for 3D TSV Applications 2017 report, March 2017, Yole Développement)

Whatever the impact of hybrid bonding within the BSI CIS, TSV interconnects will be increasingly adopted in sensors and 3D stacked memory.

The trends towards hybrid technology and TSV adoption in new areas will impact the equipment and materials market. Today, the equipment and materials markets are mainly driven by BSI CIS. However, the equipment market is expected to decline by 2019 because hybrid stacking will mean further investment in equipment dedicated to TSV manufacturing is not needed. If 3D hybrid bonding is considered as an alternative solution to 3D stacked BSI, it will then cause a decline in the overall TSV equipment market. Nevertheless, we expect the global 3D TSV equipment market to recover in the next few years thanks to increased TSV penetration rate in sensors and 3D stacked memory.

Equipment and material market forecast for 3D TSV Yole report

(Source: Equipment and Materials for 3D TSV Applications 2017 report, March 2017, Yole Développement)

Source: www.yole.fr 

RELATED REPORT

Equipment_and_Materials_for_3D_TSV_Applications_Report_March_2017_Sample.jpgEquipment and Materials for 3D TSV Applications 2017
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion

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