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Memory

United Microelectronics, a global semiconductor foundry, and Avalanche Technology, the next generation STT-MRAM (Spin Transfer Torque Magnetic RAM), announced that they have entered a partnership for joint development and production of MRAM to replace embedded flash. UMC will also make this technology available to other companies through licensing with Avalanche Technology.

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Oxide-based resistive Ram memory platform development for backend memories to offer non-volatility associated with embedded designs. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, announced the integrated-circuit industry’s first multi-project-wafer process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

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Growing demand for advanced packaging in the memory market highlights value of Veeco’s. High volume manufacturing Lithography Systems. Veeco Instruments announced that one of the memory chip manufacturers has ordered multiple AP300™ lithography systems to support the fast growing demand for DRAM with copper (Cu) pillars. The company selected the Veeco tools for their versatility in addressing advanced packaging applications, proven reliability in supporting high volume manufacturing and low total cost of ownership.
 
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Toshiba Memory, actor in memory solutions held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

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Micron and Intel announced an update to their 3D XPoint™ joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

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With the memory market booming, the Yole group of companies recently decided to launch its quarterly Memory Monitor report, covering DRAM Service – Memory Research and NAND Service – Memory Research, and the entire memory segment. The report’s first installment was just released, and it contains a wealth of timely data. Memory, fueled by huge contributions from DRAM and NAND, is poised to account for more than 1/3 of all semiconductor revenue in 2018, well above the historical average of ~25%. Enjoy!

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