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Power Electronics

  • Making personal freedom the focus of sustainable urban mobility.
  • Regulatory approval marks important milestone for joint venture.
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Over a long period, industrial companies followed up at a distance the development of GaN-based solutions mainly managed by R&D institutes and laboratories. Today the context has changed. Under the updated of its annual report, Power GaN: Epitaxy, Devices, Applications and Technology Trends, Yole Développement (Yole) identified, a lot of power electronics & compound semiconductor companies including leading players such as Infineon Technologies, STMicroelectronics… strongly engaged in significant projects of development.

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Offering innovative energy solutions globally by combining ABB's world-class power grids products, systems, software and service solutions and products with Hitachi's advanced digital technology

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“The way consumers charge their smart devices is about to drastically change,” asserts Antoine Bonnabel, Technology & Market Analyst and part of the Yole Développement’s Power & Wireless team. According to the Wireless Charging Technologies and Markets 2018 report, the wireless smartphone charging systems market is expected to surpass 1 Billion units per year by 2024.

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Opel announced its electrification plan last year and it will involve “4 electric vehicles (BEVs and PHEVs) by 2020 and a complete electrification of its lineup by 2024.” Now they also want to get involved in EV infrastructure as they announce that they want to turn their hometown of Rüsselsheim into ‘Electric City’ with 1,300 charging stations.

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Transphorm disclosed that it has shipped more than 250 thousand high voltage GaN FETs. Used in customers’ mass production applications, the devices are manufactured by the company in its Aizu, Japan, wafer foundry. Transphorm also stated that its wafer-foundry’s annual installed capacity base of 15 million parts of its popular 50 mohm product equivalent can easily scale to address 2x to 5x the volume. Further, when demand warrants it, the technology and manufacturing process can be structured to scale from the current 6-inch to 8-inch or potentially higher wafers.

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(March 17 - March 21, Anaheim, CA, USA)

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(May 7 - May 9, Nuremberg, Germany)

Latest Reports


GaN and SiC power device: market overview
Discover the presentation held by Milan Rosina, Principal Analyst in Power & Wireless Divisi...
SiC and GaN, which challenges remain in the road to success?
Discover the presentation held by Ana Villamor, Technology & market analyst in Power Electro...
How will battery pack requirements impact power electronic market ?
Discover the presentation held by Milan Rosina, Senior Technology & Market Analyst, Power El...

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