The Open RF Association (OpenRF) and the MIPI Alliance have signed a Cooperation Framework (Liaison) Agreement which allows the two organizations to engage in joint collaborative projects relating to radio frequency (RF) front-end architecture, design, and technology. The MIPI Alliance is an international organization serving industries that develop mobile and mobile-influenced devices.
The focus of the organization is to design and promote hardware and software interfaces that simplify the integration of components built into a device, from the antenna and modem to peripherals and the application processor. OpenRF is an industry consortium dedicated to expanding the functional interoperability of hardware and software across multi-mode radio frequency front end and chipset platforms into the 5G era, responding to customer demand for open architectures.
“The MIPI RFFESM specification has become the de facto interface for control of the radio frequency front end since its release in 2010, and this specification will serve as a key component of our OpenRF Register Map templates,” said Kevin Schoenrock, President, Open RF Association. “We look forward to working with the MIPI Alliance to help optimize the RF front end and to support the growing 5G device ecosystem.”
OpenRF Register Map Working Group is creating a register map framework to maximize configurability and effectiveness of the RF front end. The agreement outlines the framework for OpenRF and the MIPI Alliance to engage in disclosure and feedback interactions of the MIPI RFFE specification and the OpenRF Register Map Templates.
“This liaison agreement between MIPI Alliance and OpenRF facilitates collaboration that will benefit the entire industry,” said Peter Lefkin, Managing Director of MIPI Alliance. “We’re looking forward to working with OpenRF to extend and enhance the ecosystem that has developed around MIPI RFFE, especially to support the growing implementation of 5G applications around the world.”
Related Reports and Monitors
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
Reverse Costing - Structural, Process & Cost Report
5G Packaging Trends for Smartphones 2021
Market & Technology