An article written by Junko Yoshida, EETIMES – In a flash sale that was reportedly over in ten seconds, Huawei today launched in China its brand new P30 and P30 Pro smartphones.
Along with the launch, different technology outfits scrambled to break apart the new handsets so that they could be the first to post teardown reports.
EE Times tapped the technical expertise of System Plus Consulting (Nante, France), Yole Développement’s partner company. We asked the analysts to share their initial observations and reveal any surprises they encountered.
Stéphane Elisabeth, costing analyst expert at System Plus Consulting, told us that the focus of their P30 Pro teardown was squarely on quad cameras — including a periscope camera capable of 10X zoom. The periscope camera claims no loss in image quality, while the smartphone does not need to use a long-barrel telescopic lens.
But as the team dissected the P30 Pro, a few surprises popped up, Elisabeth told us.
First, Huawei is now using a 3-stack PCB configuration in P30 Pro. While Apple was the first smartphone vendor to do three-layer PCB in the iPhone X and Samsung followed suit, the System Plus crew didn’t expect Huawei to catch up so soon.
It turns out Huawei has used SLB (Substrate Like-PCB) assembly from Taiwan-based PCB supplier Unimicron. Apple’s iPhone X 3-stack PCB was assembled by Austria-based AT&S.
While both P30 Pro and iPhone X use similar PCB architecture in three layers, the way they use the stacks is different.
In the P30 Pro, the bottom layer embeds Huawei’s chip division HiSilicon-developed Kirin applications processor, power management ICs and passive. All RF components occupy the top layer. In between, a mid-frame PCB connects the two and serves as an isolation layer, Elisabeth explained… Full article
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