“EVs are driving the growth of power module packaging as going to mass production of EV/HEV changes the rules of game,” states Shalu Agarwal, Technology & Market Analyst at Yole Développement (Yole). “Technology alone is not enough; low cost is increasingly important.”
The power module is one of the key elements in power converters and inverters. The market for power modules will reach US$7.6 billion by 2025, with a 2019-2025 CAGR of 9.1%. In the past, packaging needs were driven by industrial applications, but today they are increasingly driven by EV/HEVs. In fact, by 2025 EV/HEVs will become the biggest power module market, representing a market value of almost US$3.4 billion. This market’s promising outlook is beneficial for the power module packaging material business. The power module packaging material market will achieve a 2019-2025 CAGR of 10.7%, being worth US$2.71 billion by 2025.
In this dynamic context, the market research & strategy consulting company releases its annual power electronics report, Status of the Power Module Packaging Industry.
In terms of technology and market forecast, this report presents a comprehensive overview of the power packaging industry at the substrate, baseplate, die-attach, substrate-attach, encapsulation, interconnection, and TIM markets.
It proposes an update on key power module packaging trends and also a focus on SiC and GaN technologies. This report is also a good opportunity to deep dive into power module substrates, technology trends, and supply chain. Furthermore, Yole’s analysts point out the power module packaging requirements for various applications. At the end, this report includes a relevant analysis of the Chinese market as well as the impact of the COVID-19 crisis.
What is the status of the power module industry and behind the packaging market? What is the economic and technological challenge? What are the impacts of the COVID-19 outbreak? Which are the leading companies to watch? How will the market evolve? What is the role of Chinese companies? Yole’s power electronics analysts present today their vision of the power module packaging industry… Full story
Related Reports and Monitors
Butterfly Network iQ CMUT Sensor
Reverse Costing - Structural, Process & Cost Report
Status of the Power Module Packaging Industry 2020
Market & Technology