#Compound Semi #Equipment & Materials #Package #Power Electronics
Power SiC 2019: Materials, Devices, and Applications
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#Equipment & Materials #MEMS, Sensors, Actuators
Qualcomm 3D Sonic Sensor Fingerprint
Reverse Costing - Structural, Process & Cost Report
#Power Electronics #RF Devices
GaN Power & RF – Patent Monitor Service
Monitors
#Imaging #MEMS, Sensors, Actuators
Melexis Far Infrared Thermal Sensor MLX90640
Reverse Costing - Structural, Process & Cost Report
#Equipment & Materials #Imaging #Memory #Package #PCB, Wafer, Substrate #Software & Computing
CMOS Image Sensor Service – Imaging Research
Monitors
#Equipment & Materials #Package #PCB, Wafer, Substrate
Status of the Advanced Packaging Industry 2019
Market & Technology
#Battery & Energy Management
Li-ion Batteries – Patent Monitoring Service
Monitors
#Compound Semi #Power Electronics
Infineon 600V CoolGaN Transistor Family
Reverse Costing - Structural, Process & Cost Report