5G Packaging Trends for Smartphones 2021

Yole Développement

5G packaging brings innovative technology and 2.6 billion dollar opportunities for SiP business.

Key features of the report

  • Global smartphone market forecast (2020-2026) including breakdown by air standard: 3G, 4G, 5G sub-6GHz and 5G mmWave
  • 5G Packaging Market forecast by units and revenue with breakdown by various RF modules: 5G sub-6GHz RF Front End module (PAMiD, DRx), 5G mmW AiP, 5G mmW discrete antenna, 5G mmW FEM
  • Antenna in Package (AiP) market forecast by units, revenue, and wafer starts
  • AiP market forecast describing various scenarios: with or without fan-out packaging
  • 5G packaging substrate market forecast by different RF modules, including AiP
  • RF front-end multi-die SiP roadmap, challenges, and technology requirements for 5G sub-6GHz and 5G mmWave (>24 GHz) bands, including antenna-in-package (AiP) trends
  • An analysis of supply chain changes and opportunities for 5G in smartphones, focusing on RF SiP manufacture and assembly, including package substrate

Objectives of the report

5G Packaging for Smartphones 2021 is a new report which focuses on both the module and component packaging for 5G Sub-6GHz and 5G mmWave. The objectives of this new report are as follows:

  • Discuss drivers and dynamics for 5G options: 5G mmWave and 5G sub-6GHz, and investigate the disruptions and opportunities there from
  • Focus on various SiP architectures in the RF front-end of cellphones.
  • RF front-end SiP market forecast in revenue, wafers, and units
  • Interconnect trends forecast for RF SiP
  • Analyze various developing RF SiP architectures for sub-6GHz and mmWave frequencies, the advantages, and suitability thereof
  • Provide an RF front-end multi-die SiP roadmap, the challenges, and technology requirements for 5G sub-6GHz and 5G mmWave (>24 GHz) bands, including antenna-in-package (AiP) trends
  • Analyze supply chain changes and opportunities for 5G in smartphones, focusing on RF SiP manufacture and assembly, including package substrate

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