Advanced Packaging Quarterly Market Monitor

Yole Développement

FCCSP packaging market to rise to new heights reaching $8B+ in 2026 driven by mobile & consumer applications.

Key features of the monitor

  • Quarterly data update on key advanced package types such as FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, and 3D Stacked packages
  • Market forecast through 2026, in $US, units and wafer forecast
  • ASP analysis, per market segment
  • End-product/device application mix
  • Key process-technology mix
  • Supplier market share (TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix, Sony)
  • Demand forecast through 2026, by category (i.e. mobile, consumer, telecom, infrastructure)
  • CapEx and capacity, per supplier

 

This monitor is not part of our Bundled Offer and full Yole Développement yearly subscription.

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