Advanced Packaging Quarterly Market Monitor

Yole Développement

Despite weak semiconductor demand, Wafer Level Packaging reaches new heights as Fan-Out package revenue to surpass $2B by 2025 and Wafer Level Chip Scale Packaging revenue to peak to $3B by 2025.

Key features of the monitor

  • Quarterly data update
  • Market forecast through 2025, in $US, units
  • ASP analysis, per market segment
  • End-product/device application mix
  • Key process-technology mix
  • Supplier market share (TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE , PTI, Nepes/ Deca, SPIL, Huatian, TI) in terms of units, $US, and wafers
  • Demand forecast through 2025, by category (i.e. mobile, consumer, telecom & infrastructure)
  • CapEx and capacity, per supplier


This monitor is not part of our Bundled Offer and full Yole Développement yearly subscription.

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