Advanced Packaging Quarterly Market Monitor

Yole Développement

Total Advanced Packaging 300 mm eq. wafer output is expected to grow at 8.12% CAGR2020-2026, with FCCSP and FCBGA taking the major share over the next few years and 2.5D/3D growing at the fastest rate

Key features of the monitor

  • Quarterly data update on key advanced package types such as FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, 3D-stacked packages ans SiPs
  • Market forecast through 2026, in $US, units and wafer forecast
  • ASP analysis, per market segment
  • End-product/device application mix
  • Key process-technology mix
  • Supplier market share (TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix, Sony)
  • Demand forecast through 2026, by category (i.e. mobile, consumer, telecom, infrastructure)
  • CapEx and capacity, per supplier

 

This monitor is not part of our Bundled Offer and full Yole Développement yearly subscription.

Cet article vous a plu ?

Partagez-le sur vos réseaux sociaux