Investments from the top advanced packaging players over the last two years exceed one third of the market’s value projected for 2027.
Key features of the monitor
- Direct access to the analyst providing opportunity for Q&A
- Packaging industry dynamics highlights and analyst point of view
- Quarterly data update on key advanced package types, including FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, 3D-stacked packages, and SiP
- Market forecast through 2027, in $US, units and wafers
- ASP analysis, per market segment
- End-product/device application mix
- Key process/technology mix
- Supplier market shares for TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix and Sony
- Demand forecast through 2027, by category including mobile, consumer, telecom, and infrastructure
- CapEx and capacity per supplier
Product objectives
- The Fan-Out, WLCSP/Fan-In, 3D Stacked, FCBGA, FCCSP and SiP markets are studied
- Near-term market dynamics on a quarterly basis
- Long-term market dynamics for 2021-2027
- CapEx and capacity per major player
- Market shares of leading OSATs/Foundries/IDMs
- Package ASP per given market/platform
- Device/application adoption for advanced packaging technologies
What’s new
- End systems updated in all modules
- FCBGA, FCCSP and UHD FO ASPs were revised and updated to reflect substrate price increase
- CIS forecast was updated impacting overall 2.5D and 3D forecast
- 2.5D and 3D stacked packaging platforms segmentation update
- UTAC’s revenue was updated, YoY and the OSAT ranking was updated accordingly
- More Chinese OSATs were added to the list of main players to get a better understanding of the strengthening of this growing ecosystem
- A study on the top 10 Chinese OSATs was added
- New commercial products using advanced packaging technology were announced or released
This monitor is not part of our Bundled Offer and full Yole Développement yearly subscription.
Table of contents
Description
Monitored companies