Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

System Plus Consulting

Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA



  • Detailed photos and cross-sections
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price

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